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Modeling Material Properties of Lead-Free Solder Alloys

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Abstract

A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys.

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References

  1. U.R. Kattner, JOM, December, 45 (2002)

  2. X.J. Liu, I. Ohnuma, C.P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode, T. Koyama, H. Onodera, T. Suzuki, J. Electron. Mater., 32, (2003) 1265

    Article  CAS  Google Scholar 

  3. Z. Moser, W. Gasior, J. Pstrus, S. Ishihara, X.J. Liu, I. Ohnuma, Mater. Trans., 45, (2004), 652

    Article  CAS  Google Scholar 

  4. N. Moelans, K.C. Hari Kumar, P. Wollants, J. Alloys Compd., 360, (2003), 98

    Article  CAS  Google Scholar 

  5. S.W. Yoon, J.R. Soh, H.M. Lee, B.J. Lee, Acta Mater., 45, (1997) 951

    Article  CAS  Google Scholar 

  6. N. Saunders, Z. Guo, X. Li, A.P. Miodownik, and J.P. Schillé, JOM, December, 60 (2003)

  7. N. Saunders, Aluminium Alloys, their Physical and Mechanical Properties, ed. J.F. Nie et al. (Melbourne, Australia: Inst. Mater. Eng. Australasia), p. 96

  8. X. Li, A.P. Miodownik, N. Saunders, Mater. Sci. Tech., 18, (2002), 861

    Article  CAS  Google Scholar 

  9. N. Saunders, Z. Guo, X. Li, A.P. Miodownik, and J.P. Schillé, Superalloys 2004 (10th International Symposium on Superalloys, Champion, Pennsylvania, 19–23 September, 2004), ed. K. Green et al. (Warrendale, PA: TMS, 2004), pp.␣849–858

  10. N. Saunders, X. Li, A.P. Miodownik, J.-Ph. Schillé, Ti-2003 Science and Technology, ed. G. Luetering, J. Albrecht (Weinheim, Germany: Wiley-VCH, 2004), pp. 1397–1404

    Google Scholar 

  11. L. Kaufman, H. Bernstein, Computer Calculations of Phase Diagrams, (New York: Academic, 1970)

    Google Scholar 

  12. N. Saunders and A.P. Miodownik, CALPHAD – Calculation of Phase Diagrams, Pergamon Materials Series, Vol. 1, ed.␣R.W. Cahn (Oxford: Elsevier Science, 1998)

  13. T. Siewert, S. Liu, D.R. Smith, and J.C. Madeni, Properties of Lead-Free Solders, Release 4.0 (NIST and Colorado School of Mines, 2002), http://www.boulder.nist.gov/div853/lead% 20free/solders.html

  14. Indium Corporation of America, Europe and Asia, http://www.indium.com/products/alloychart.php

  15. Z. Fan, P. Tsakiropoulos, A.P. Miodownik, J. Mat. Sci., 29 (1994) 141

    Article  CAS  Google Scholar 

  16. Z. Fan, Phil. Mag. A, 73 (1996), 1663

    Article  CAS  Google Scholar 

  17. N. Saunders, X. Li, A.P. Miodownik, and J.P. Schillé, Modelling of Casting, Welding and Advanced Solidification Processes X, ed. D. Stefanescu, J.A. Warren, M.R. Jolly, and M.J.M. Krane (Warrendale, PA: TMS, 2003), pp. 669–676

  18. P.T. Vianco, Sandia Laboratories (2001) as given in Ref. 13

  19. J.A.V. Butler, Proc. Roy. Soc A, 135, (1932), 348

    Article  Google Scholar 

  20. T. Tanaka, K. Hack, and S. Hara, MRS Bull. April, 45 (1999)

  21. J.H. Lee, D.N. Lee, J. Electron. Mater., 30, (2001), 1112

    Article  CAS  Google Scholar 

  22. W. Gasior, Z. Moser, A. Debski, Arch. Metall. Mat., 49, (2004), 575

    CAS  Google Scholar 

  23. R. Picha, J. Vrestal, A. Kroupa, CALPHAD, 28, (2004), 141

    Article  CAS  Google Scholar 

  24. G. Metzger, Z. Phys. Chem, 211, (1959), 1

    CAS  Google Scholar 

  25. J.C. Joud, N. Eustathopoulos, A. Bricard, P. Desre, J. Chim. Phys. 70, (1973), 1290

    CAS  Google Scholar 

  26. R. Pajarre, P. Koukkari, T. Tanaka, J. Lee, CALPHAD, 30, (2006), 196

    Article  CAS  Google Scholar 

  27. T. Tanaka, T. Iida, Steel Res., 65, (1994), 21

    CAS  Google Scholar 

  28. K. Mori, M. Kishimoto, T. Shimose, Y. Kawai, J. Jap. Inst. Metals, 39, (1975), 1301

    CAS  Google Scholar 

  29. X.J. Liu, Y. Inohana, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, J. Pstrus, J. Electron. Mater., 31, (2002), 1139

    Article  CAS  Google Scholar 

  30. A.P. Miodownik, Sente Software Ltd., Guildford, Surrey, U.K. (2006), unpublished work

  31. R. Novakovic, E. Ricci, F. Gnecco, D. Giuranno, G. Borzone, Surf. Sci., 599, (2005), 230

    Article  CAS  Google Scholar 

  32. N. Saunders, Solidification Processing 1997, ed. J. Beech and H. Jones (Sheffield: University of Sheffield, 1997), pp.␣362–366

  33. http://www.interfluxusa.com/Technical/Sixsigma.htm

  34. N. Saunders, Z. Guo, X. Li, A.P. Miodownik, J.P. Schillé, JOM, 55 (12), (2003), 60

    Article  CAS  Google Scholar 

  35. Z. Guo, N. Saunders, A.P. Miodownik, J.P. Schillé, Mater. Sci. Eng. A413–414, (2005), 465

    Google Scholar 

  36. http://www.nemi.org/cms/newsroom/Presentations/lf_workshop_report.html

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Authors and Affiliations

  1. Sente Software Ltd., Surrey Technology Centre, The Surrey Research Park, Guildford, Surrey, UK

    Zhanli Guo, Nigel Saunders, Peter Miodownik &  Jean-Philippe Schillé

Authors
  1. Zhanli Guo
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  2. Nigel Saunders
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  3. Peter Miodownik
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  4. Jean-Philippe Schillé
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Correspondence to Zhanli Guo.

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Guo, Z., Saunders, N., Miodownik, P. et al. Modeling Material Properties of Lead-Free Solder Alloys. J. Electron. Mater. 37, 23–31 (2008). https://doi.org/10.1007/s11664-007-0218-1

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  • DOI: https://doi.org/10.1007/s11664-007-0218-1

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