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Reduction of proximity effect in electron beam lithography by deposition of a thin film of silicon dioxide

  • Materials (Organic, Inorganic, Electronic, Thin Films), Polymer, Fluidization, Particle Technology
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Abstract

We present a simple strategy to reduce the writing time of electron beam lithography (EBL) by using a highly sensitive Shipley’s UV-5 resist while reducing proximity effects by depositing a thin film of silicon dioxide (SiO2) on silicon substrate. It was found that a simple insertion of a thin SiO2 film greatly reduced proximity effects, thereby providing enhanced resolution and better pattern fidelity. To support this conclusion, the bottom line width and sidewall slope of the developed pattern were analyzed for each substrate with different film thickness.

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Authors and Affiliations

  1. School of Mechanical and Aerospace Engineering and the Institute of Bioengineering, Seoul National University, Seoul, 151-742, Korea

    Chang-Ho Seo & Kahp-Yang Suh

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  1. Chang-Ho Seo
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  2. Kahp-Yang Suh
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Correspondence to Kahp-Yang Suh.

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Seo, CH., Suh, KY. Reduction of proximity effect in electron beam lithography by deposition of a thin film of silicon dioxide. Korean J. Chem. Eng. 25, 373–376 (2008). https://doi.org/10.1007/s11814-008-0062-x

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  • DOI: https://doi.org/10.1007/s11814-008-0062-x

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