Abstract
The electrical and mechanical properties of metal films on polymer Substrates are of interest for use inflexible electronic devices and sensors. In these Systems, film deformation mechanisms are comparable to those from free-standing films but the influence of the Substrate and the Interface on the film properties is yet to be fully understood. This understanding is critical to further design improvements and advanced in situ characterization holds the promise of making this possible. With the aid of such techniques direct Observation of failure and deformation mechanisms has become possible.
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Cordill, M.J. Flexible film systems: Current understanding and future prospects. JOM 62, 9–14 (2010). https://doi.org/10.1007/s11837-010-0096-5
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DOI: https://doi.org/10.1007/s11837-010-0096-5