Abstract
Compound and simple droplets have been studied and appeared in many life applications, e.g., drug processing and microfluidic systems. Many studies have been conducted on the thermocapillary effects on simple droplets, but similar studies on compound droplets are quite rare. Filling this missing gap, this paper presents the front-tracking-based simulation results of the thermocapillary effects on compound droplets in a certain limited domain. The compound droplet consists of a single inner core that is initially concentric with the outer one. Various dimensionless parameters including Reynolds number from 1 to 50, Marangoni number from 1 to 100, droplet radius ratio from 0.3 to 0.8, and viscosity ratios from 0.1 to 6.4 are varied to reveal their influences on the migration of a compound droplet from cold to hot regions. Initially, the inner droplet moves faster than the outer one, and when the leading surface of the inner droplet touches the outer one, the inner and outer droplets migrate at the same speed. The effects of these parameters on the compound droplet eccentricity are also considered.
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This research is funded by the Vietnam National Foundation for Science and Technology Development under grant number 107.03-2019.307.
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Vinh T. Nguyen is a Ph.D. student of the Graduate University of Science and Technology, Vietnam Academy of Science and Technology, Hanoi, Vietnam. He received his M.S. in Mechanical Engineering from the Keio University, Japan. His research interests include aerospace structures, multiphase and free surface flows, heat transfer, and numerical methods.
Truong V. Vu is a Lecturer of the Faculty of Vehicle and Energy Engineering, Phenikaa University, Hanoi, Vietnam. He received his Ph.D. in Integrated Science and Engineering from the Ritsumeikan University, Japan. His research interests include multiphase and free surface flows, phase change heat transfer, and numerical methods.
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Nguyen, V.T., Vu, T.V., Nguyen, P.H. et al. Thermocapillary migration of a fluid compound droplet. J Mech Sci Technol 35, 4033–4044 (2021). https://doi.org/10.1007/s12206-021-0816-5
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DOI: https://doi.org/10.1007/s12206-021-0816-5