Skip to main content
SpringerLink
Log in

Warpage of Powder Injection Molded Copper Structure

  • Published:
Metals and Materials International Aims and scope Submit manuscript

Abstract

Powder injection molding (PIM) is an advanced manufacturing technology with advantages including shape complexity, high production rate, and high physical/mechanical properties. However, because PIM has many sub-steps, such as mixing, injection molding, debinding, and sintering, the optimization of each process condition is important to avoid defects including warpage, crack, and blister. In this paper, the warpage, one of the most common defects in PIM, is investigated by using thin square copper structures with lengths of 10 mm and thicknesses of 600 and 190 μm. The warpage of each structure is measured by using a white light interferometric surface profiler. The measured warpage of the structure fabricated by the standard process is 3.771 μm. When the solvent debinding step is absent, the warpage becomes 8.052 μm. Additionally, sensitivity analysis determines that the effect of the thermal debinding step’s heating rate is dominant to warp the structure. Normalized sensitivities of the debinding heating rates are 0.58 for the structure with a thickness of 600 μm and 0.63 for the other structure. Finally, how to optimize the processing condition is outlined.

Graphic Abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. R.M. German, A. Bose, Injection Molding of Metals and Ceramics, 1st edn. (Metal Power Industries Federation, New Jersey, 1997), pp. 11–54

    Google Scholar 

  2. L. Liu, N.H. Loh, B.Y. Tay, S.B. Tor, Y. Murakoshi, R. Maeda, Acta Mater. 56, 5560 (2008)

    Article  CAS  Google Scholar 

  3. J.W. Oh, W.S. Lee, S.J. Park, Metals Mater. Int. 24, 142 (2018)

    Article  CAS  Google Scholar 

  4. H. Cho, J. Godinez, J.S. Han, D. Fadda, S.M. You, J. Lee, S.J. Park, Materials 12, 507 (2019)

    Article  CAS  Google Scholar 

  5. W.J. Tseng, J. Mater. Process. Technol. 102, 14 (2000)

    Article  Google Scholar 

  6. J. Meng, N.H. Loh, G. Fu, S.B. Tor, B.Y. Tay, J. Alloys Compd. 496, 293 (2010)

    Article  CAS  Google Scholar 

  7. W.J. Tseng, D.M. Liu, Ceram. Int. 24, 125 (1998)

    Article  CAS  Google Scholar 

  8. S.G. Li, G. Fu, I. Reading, S.B. Tor, N.H. Loh, P. Chaturvedi, S.F. Yoon, K. Youcef-Toumi, Appl. Phys. A 89, 721 (2007)

    Article  CAS  Google Scholar 

  9. A. Keshavarz Panahi, H. Mianajiy, E. Miandoabchi, M. Hussaini Fareed, J. Manuf. Sci. Eng. 135, 011006 (2013)

    Article  Google Scholar 

  10. V. Friederici, M. Ellerhorst, P. Imgrund, S. Krämer, N. Ludwig, Powder Metall. 57, 5 (2014)

    Article  CAS  Google Scholar 

  11. H. Zhang, X. He, X. Qu, L. Zhao, Mater. Sci. Eng. A 526, 31 (2009)

    Article  Google Scholar 

  12. C. Wang, Z. Lu, K. Zhang, Materials 11, 1864 (2018)

    Article  Google Scholar 

  13. L. Poh, C. Della, S. Ying, C. Goh, Y. Li, Powder Technol. 328, 256 (2018)

    Article  CAS  Google Scholar 

  14. C. Veeresh Nayak, G.C. Manjunath Patel, M.R. Ramesh, V. Desai, S.K. Samanta, Materials Forming, Machining and Post Processing, 1st edn. (Springer, Cham, 2019), pp. 41–74

    Google Scholar 

  15. C.W. Gal, S.S. Han, J.S. Han, D. Lin, S.J. Park, Int. J. Appl. Ceram. Technol. 16, 315 (2019)

    Article  CAS  Google Scholar 

  16. R.M. German, A. Bose, Injection Molding of Metals and Ceramics, 1st edn. (Metal Power Industries Federation, New Jersey, 1997), pp. 175–218

    Google Scholar 

  17. R.M. German, A. Bose, Injection Molding of Metals and Ceramics, 1st edn. (Metal Power Industries Federation, New Jersey, 1997), pp. 219–264

    Google Scholar 

  18. B. Ozcelik, I. Sonat, Mater. Design 30, 367 (2009)

    Article  CAS  Google Scholar 

  19. H.T. Lim, S.H. Kim, H.D. Im, K.H. Oh, S.H. Jeong, J. Micromech. Microeng. 18, 105013 (2008)

    Article  Google Scholar 

  20. G. Zhou, J. Li, L. Lv, Appl. Thermal Eng. 109, 514 (2016)

    Article  Google Scholar 

  21. R.M. German, A. Bose, Injection Molding of Metals and Ceramics, 1st edn. (Metal Power Industries Federation, New Jersey, 1997), pp. 99–132

    Google Scholar 

  22. J. Raja, V. Radhakrishnan, Wear 57, 147 (1979)

    Article  Google Scholar 

  23. S.V. Atre, S.J. Park, R. Zauner, R.M. German, Powder Metall. 50, 76 (2007)

    Article  CAS  Google Scholar 

  24. J.H. Jeong, S.K. Ryu, S.J. Park, H.C. Shin, J.-H. Yu, Comput. Mater. Sci. 100, 21 (2015)

    Article  Google Scholar 

  25. Z. Shi, Z.X. Guo, J.H. Song, Acta Mater. 50, 1937 (2002)

    Article  CAS  Google Scholar 

  26. D. Lin, S.T. Chung, Y.S. Kwon, S.J. Park, J. Mech. Sci. Technol. 30, 1859 (2016)

    Article  Google Scholar 

  27. H.E. Kissinger, Anal. Chem. 29, 1702 (1957)

    Article  CAS  Google Scholar 

  28. S.J. Park, Y. Wu, D.F. Heaney, X. Zou, G. Gai, R.M. German, Metall. Mater. Trans. A 40, 215 (2009)

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by POSCO and the National Research Foundation of Korea (NRF) Grant (NRF-2019R1A2C3003129) funded by the Ministry of Science and ICT (MSIT), Republic of Korea.

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Republic of Korea

    Hanlyun Cho, Jae Man Park, Junsuk Rho & Seong Jin Park

  2. Department of Chemical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Republic of Korea

    Junsuk Rho

Authors
  1. Hanlyun Cho
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jae Man Park
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Junsuk Rho
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Seong Jin Park
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Seong Jin Park.

Ethics declarations

Conflict of interest

The authors declare that they have no conflict of interest.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Cho, H., Park, J.M., Rho, J. et al. Warpage of Powder Injection Molded Copper Structure. Met. Mater. Int. 27, 1131–1137 (2021). https://doi.org/10.1007/s12540-019-00492-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12540-019-00492-z

Keywords

Search

Navigation