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3-D Simulation of Novel High Performance of Nano-Scale Dual Gate Fin-FET Inserting the High-K Dielectric TiO2 at 5 Nm Technology

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Abstract

The evolution of integrated circuit is based on the miniaturization of dimension in the transistor Mosfet, this reduction causes the undesirable effect: short channel effects (SCE) and hot carrier effect, the principal goal is to search for a device which can minimize this effects, thus, in this work we proposed a new device for the dual gate DG-FinFET with TiO2 material for smaller gate length Lg = 5 nm by using the TCAD-SILVACO simulator. Additionally, we explain the electrical characteristics of this device on various parameters such us: threshold voltage Vth, subthreshold slope (SS), the on-current (Ion), the off-current (Ioff), Ion/Ioff current ratio, the DIBL (drain induced barrier lowering), and the electrical field E. The results show that our structure gives excellent electrical characteristics. It requires the use of high-k dielectric of gate TiO2 and to the shorter gate length (Lg). Furthermore, the decreasing of the electrical field along the channel proves the suppressing of the hot carrier effect; we examine also the effect of variation of gate length (Lg) on this parameter. We obtained the following results: our simulation is improved for the smaller gate length Lg = 5 nm than (6, 8, 10 and 12) nm. So we noticed that the proposed device is the most compatible for increasing the performance of device (the reliability, the lower power and speeder circuit), also the TiO2 material is the best dielectric of gate with combination of metal gate TiN for the future of nanoscale device.

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References

  1. Erry Dwi Kurniawan, Hao Yang, Chia-Chou Lin, Yung-ChunWu, Effect of fin shape of tapered FinFETs on the device performance in 5-nm node CMOS technology, 12454; No. 6. doi: https://doi.org/10.1016/j.microrel.2017.06.037

  2. Boukortt N, Hadri B, Patanè S, Caddemi A, Crupi G Electrical characteristics of 8-nm SOI n-FinFETs. Springer, ISSN 1876-990X. https://doi.org/10.1007/s12633-016-9428-6.2016

  3. Sangam Lal Jaiswal, Anil Kumar, A.K.Jaiswal, Rajeev Paulus and Mayur Kumar, Study of Electrical Characteristics of SOI n-MOSFET at Various Technological Nodes, ijcet, Vol.4, No.3, P-ISSN 2347–5161. INPRESSCO, June2014

  4. Slimani Samia, Djellouli Bouaza, High dielectric permittivity impact on SOI Double-Gat, mee. 112, Elseiver (2013) 213–219, 0167–9317 /j.mee.2013.04.015

  5. Vinay Kumar, Richa Gupta, Raminder Preet Pal Singh, Rakesh Vaid. Performance Analysis of Double Gate n-FinFET Using High-k Dielectric Materials, IJIRSET Vol. 5, Issue 7, July 2016, DOI https://doi.org/10.4010/2016.1462, ISSN 2321 3361

  6. Rajesh Kumar, Rajesh Mehra, Impact Analysis of DGMOSFET using High-k Dielectric material, (IJETT), 2016 – Volume 34 Number 4- ISSN: 2231–5381

  7. Richa Gupta, Rakesh Vaid TCAD performance analysis of high-K dielectrics for gate all around InAs nanowire transistor considering scaling of gate dielectric thickness, j mee. Elseiver 0167–9317/ 2016

  8. Nour El Islam Boukortt, Effects of High-k Dielectric Materials on Electrical Characteristics of DG n- FinFETs, (0975–8887) Volume 139 – No.10, April 2016

  9. S. Prasanna kumar, P.Sandeep and Sudhanshu Choudhary, Changes in transconductance (gm) and Ion/Ioff with high-K dielectrics in MX2 monolayer 10 nm channel double gate n-MOSFET, DOI: https://doi.org/10.1016/j.spmi.2017.07.021

  10. Nour El Islam Boukortt, Baghdad Hadri Alina Caddemi, Giovanni Crupi and Salvatore Patanè, 3-D Simulation of Nanoscale SOI n-FinFET at a Gate Length of 8 nm Using ATLAS SILVACO, Vol. 16, No. 3, 2015 pISSN: 1229–7607 DOI:https://doi.org/10.4313/TEEM.2015.16.3

  11. Weichun Luo, Hong Yang, Wenwu Wang, Yefeng Xu, Bo Tang, Shangqing Ren, Hao Xu, YanrongWang, Luwei Qi, Jiang Yan, Huilong Zhu, Chao Zhao, Dapeng Chen, Tianchun Ye, Accurate lifetime prediction for channel hot carrier stress on sub-1 nmequivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer MR-11954; No.4, doi: j.microrel. 2016.03.008

  12. D. Nirmal A , P. Vijayakumar b , P. Patrick Chella Samuel a , Binola K. Jebalin a & N. Mohankumar, Subthreshold analysis of nanoscale FinFETs for ultralow power application using high-k materials International Journal of Electronics, (2014), 100:6, 803–817, DOI: https://doi.org/10.1080/00207217.2012.720955

  13. Vudumula Pavan Kumar Reddy, Siva Kotamraju, Improved device characteristics obtained in 4H-SiC MOSFET using high-k dielectric stack with ultrathin SiO2-AlN as interfacial layers, 80 (2018) 24 30 pp, 1369–8001 DOI: /https://doi.org/10.1016/j.mssp.2018.02.012

  14. Chung GS et al (2010) Electrical characterization of au/3C- SiC/n-Si/Al Schottky junction. J Alloys Compd vol 507:508–512

    Article  CAS  Google Scholar 

  15. Yadav Nidhi Ratiram, Anjali Chawla, Performance Comparison of FD-SOI MOSFET with Different Gate Dielectric at 32nm Technology IJESC, Vol. 6, Issue No. 5, DOI https://doi.org/10.4010/1462 ISSN 2321 3361.2016

  16. Ankita Wagadre, Shashank Mane, Design & Performance Analysis of DG-MOSFET for Reduction of Short Channel Effect over Bulk MOSFET at 20nm , ijera, Vol. 4, Issue 7 (Version1), July 2014, pp.30–34

  17. Meysam Zareiee, Ali A. Orouji, Superior Electrical Characteristics of Novel Nanoscale MOSFET with Embedded Tunnel Diode, No.30 PII: S0749 6036(16)31082–5 DOI: https://doi.org/10.1016/j.spmi.2016.11.022

  18. S. K. Mohapatra, K. P. Pradhan and P. K. Sahu, Some device design consideration to enhance the performance of DG-MOSFET, Transaction Electrical and Electron Materials, vol. 14, pp. 291–294, 201

  19. Das, R., Goswami, R., and Baishya, Tri-gate heterojunction SOI Ge-FinFETs, 2016 Superlattices Microstrut, 91, 51–61

  20. Meysam Zareiee, A novel high performance nano-scale MOSFET by inserting Si3N4 layer in the channel, journal homepage: (2015), No.8, 0749–6036

  21. Yashu Swami, Sanjeev Rai, Modeling and analysis of sub-surface leakage current in nano-MOSFET under cut-off regime, Superlattices and Microstructures journal homepage: 102 (2017) No, 259–272, j.spmi.2016.12.044 0749–6036/Elsevier

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Acknowledgments

We want to thank the author who encouraged us to do this work. Their availability, their valuable advice allowed me to work in the best conditions. I will not forget the contribution of colleagues in the department of physics and in the lab ECP3M in Mostaganem to carry out this work.

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Correspondence to N. Bourahla.

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Bourahla, N., Hadri, B. & Bourahla, A. 3-D Simulation of Novel High Performance of Nano-Scale Dual Gate Fin-FET Inserting the High-K Dielectric TiO2 at 5 Nm Technology. Silicon 12, 1301–1309 (2020). https://doi.org/10.1007/s12633-019-00220-7

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