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Creep Behaviour of SAC387 Lead Free Solder Alloy Reinforced with Single Walled Carbon Nanotubes

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Abstract

The effect of addition of single walled carbon nanotubes (SWCNTs) on creep behaviour of Sn–3.8Ag–0.7Cu (SAC387) lead free solder alloy was investigated. The creep tests were carried out using indentation technique by means of a nanoindenter. Modified Garofalo’s creep model showed an excellent fit to the indentation depth versus time data and was used to extract the creep parameters. The results showed that the steady state creep rate as well as primary creep stage displacement and primary creep stage time decreased with increasing addition of SWCNT to the base alloy.

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Acknowledgements

The authors thank Dr. A. A. Gokhale, Director, DMRL for his permission to publish this paper. The authors are also grateful to Defence Research and Development Organization for providing the funding and facilities to carry out this work.

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Authors and Affiliations

  1. Defence Metallurgical Research Laboratory, Hyderabad, India

    V. L. Niranjani, Vajinder Singh & S. V. Kamat

  2. Applied Materials, Singapore, Singapore

    B. S. S. Chandra Rao

Authors
  1. V. L. Niranjani
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  2. Vajinder Singh
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  3. B. S. S. Chandra Rao
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  4. S. V. Kamat
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Correspondence to V. L. Niranjani.

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Niranjani, V.L., Singh, V., Chandra Rao, B.S.S. et al. Creep Behaviour of SAC387 Lead Free Solder Alloy Reinforced with Single Walled Carbon Nanotubes. Trans Indian Inst Met 68, 311–317 (2015). https://doi.org/10.1007/s12666-014-0458-8

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  • DOI: https://doi.org/10.1007/s12666-014-0458-8

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