Skip to main content
Log in

An investigation of reliability and variability issues in nanoscale SOI and multi-gate MOSFETs: modelling, simulation and characterization

  • S.I. : Visvesvaraya
  • Published:
CSI Transactions on ICT Aims and scope Submit manuscript

Abstract

This work encapsulates research being carried out in the Device and Wafer Level Characterization Lab at the Department of Electrical Engineering, IIT Delhi in the field of nano-electronics device characterization and modeling. Performance of different multi-gate device architectures, as well as their reliability and variability in different working conditions is investigated using measurement and simulations. The reliability of 180-nm fully and partially-depleted SOI MOSFETs has been extensively studied against heavy-ion irradiation for outer space applications. Exposure to heavy ion radiation can result in single event effects in semiconductor-based devices and circuits. Therefore, the transient response to heavy ion irradiation is presented for 6T-SRAM cell. Moreover, self-heating (SH) is an undesirable phenomenon in highly scaled sub-10 nm devices and it is also a major reliability concern. The heat accumulation in devices due to SH is explored and a comparison among nanowire FET, FinFET, and iFinFET is presented. Our results show that the device performance will be affected for space as well as analog and digital applications due to self-heating and heavy-ion irradiations. Process variability is also an obstacle at sub-10 nm device design and its proper consideration is important for analog as well as digital circuit designs. Therefore, we have extracted a SPICE based compact model for nanowire FETs from the measured data. We then run Monte-Carlo simulations to incorporate the effects of process variations on the performance of nanowire-MOSFETs.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13

Similar content being viewed by others

References

  1. Aditya K (2018) Transient response of 0.18-μm SOI MOSFETs and SRAM bit-cells to heavy-ion irradiation for variable SOI film thickness. IEEE Trans Electron Devices 65(11):4826–4833

    Article  Google Scholar 

  2. Castellani-Coulie K (2005) Simulation analysis of the bipolar amplification in fully depleted SOI technologies under heavy-ion irradiations IEEE Trans. Nucl Sci 52(5):1474–1479

    Article  Google Scholar 

  3. Ferlet-Cavrois V (2002) Insights on the transient response of fully and partially depleted SOI technologies under heavy-ion and dose-rate irradiations. IEEE Trans Nucl Sci 49(6):2948–2956

    Article  Google Scholar 

  4. Baumann R (2002) The impact of technology scaling on soft error rate performance and limits to the efficacy of error correction. In: IEDM Technical Digest, pp 329–332

  5. Nackaerts A (2004) A 0.314/spl mu//m/sup 2/6T-SRAM Cell build with tall triple-gate devices for 45 nm node applications using 0.75NA 193 nm lithography. In: IEEE international electron devices meeting, pp 11.3.1–11.3.2

  6. Anil KG (2005) CMP-less integration of fully Ni-silicided metal gates in FinFETs by simultaneous silicidation of the source, drain, and the gate using a novel dual hard mask approach. In: Symposium on VLSI technology

  7. Kumar M (2014) Physics based analytical model for surface potential and subthreshold current of cylindrical Schottky Barrier gate all around MOSFET with high-k gate stack. Solid State Electron 101:13–17

    Article  Google Scholar 

  8. Kumar M (2016) Analytical model of threshold voltage degradation due to localized charges in gate material engineered Schottky barrier cylindrical GAA MOSFETs. Semicond Sci Technol 31:105013-1-105013-10

    Google Scholar 

  9. Hunley DP (2013) Analytical model for self-heating in nanowire geometries. J Appl Phys 113:234306-1-7

    Article  Google Scholar 

  10. Takaahashi T (2017) Self-heating effects in nanoscale 3D MOSFETs physics of semiconductor devices. CRC Press, Boca Raton

    Google Scholar 

  11. Chang CW (2015) Thermal behavior of self-heating effects in FinFET devices acting on back-end interconnects. In: International reliability physics symposium, Monterey, pp 2F.6.1–2F.6.5

  12. Singh R (2016) 7-nm nanowire FET process variation modeling using industry standard BSIM CMG model. In: ICEE, pp 1–4

  13. Miyama M (2000) Statistical BSIM3 model parameter extraction and fast/slow model parameter determination for high speed sram parametric yield estimation. In: Statistical metrology, 2000 5th international workshop on. IEEE, pp 42–45

  14. Griffoni A (2007) Effects of heavy-ion strikes on fully depleted SOI MOSFETs with ultra-thin gate oxide and different strain-inducing techniques. IEEE Trans Nucl Sci 54(6):2257–2263

    Article  Google Scholar 

  15. Gasiot G (2001) Comparison of the sensitivity to heavy ions of 0.25 μm bulk and SOI technologies. In: Proceedings of 6th European conference on radiation and its effects on components and systems (RADECS), pp 211–216

  16. Massengill LW (1990) Single event charge enhancement in SOI devices. IEEE Electron Device Lett 11(2):98–99

    Article  Google Scholar 

  17. International Technology Roadmap for Semiconductors (ITRS) (2015) [Online]. https://www.semiconductors.org

  18. Jang D (2015) Self-heating on bulk FinFET from 14 nm down to 7 nm node. In: 2015 IEEE international electron devices meeting (IEDM), Washington, DC, pp 11.6.1–11.6.4

  19. Suchitra K (2017) Optimal gate length estimation of iFinFET. In: ICNETS2, pp 23–25

  20. Zheng P (2015) Simulation-based study of the inserted-oxide FinFET for future low power system-on-chip applications. IEEE Electron Device Lett 36(8):742–744

    Article  Google Scholar 

  21. Zheng P (2015) FinFET evolution toward stacked-nanowire FET for CMOS technology scaling. IEEE Trans Electron Devices 62(12):3945–3950

    Article  Google Scholar 

  22. Jain I (2016) Comparison of heat outflow in dense sub-14 nm contemporary NFETs: Bulk/SOI, inserted-oxide FinFET and nanowire FET. In: ICEE, pp 1–4

  23. Singh R (2018) Evaluation of 10 nm bulk FinFET RF performance-conventional vs. NC-FinFET. IEEE Electron Device Lett 39(8):1246–1249

    Article  Google Scholar 

Download references

Acknowledgements

This work is an outcome of the R&D work undertaken in the project under the Visvesvaraya Ph.D. Scheme of Ministry of Electronics & Information Technology, Government of India, being implemented by Digital India Corporation (formerly Media Lab Asia). Also, this research was supported by DST, Government of India, through TSG under the Grant DST/TSG/AMT/2015/339 (General).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Abhisek Dixit.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kumar, M., Aditya, K., Singh, R. et al. An investigation of reliability and variability issues in nanoscale SOI and multi-gate MOSFETs: modelling, simulation and characterization. CSIT 7, 209–214 (2019). https://doi.org/10.1007/s40012-019-00228-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40012-019-00228-9

Keywords

Navigation