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Numerical Analysis of Couple Stress Nanofluid in Temperature Dependent Viscosity and Thermal Conductivity

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Abstract

This communication reports on an innovative study of two-dimensional couple stress fluid 3 with effect of viscosity and conductivity. We proposed a new model based on temperature dependent variable thermal conductivity on kinetic theory. Our model assumes that thermal conductivity is a decreasing function of temperature rather than an increasing function. The effect of the three key parameters, viscosity, thermal conductivity and couple stress parameter are analyzed. The coupled non-linear system is further validated numerically using the spectral quasilinearization method. The method is found to be accurate and convergent. Increasing the temperature dependent parameter for viscosity is shown to reduce the heat mass transfer rates at the surface. Increasing thermal conductivity and the couple stress parameter increased the heat mass transfer rates on the boundary surface

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Authors and Affiliations

  1. Department of Applied Mathematics, National University of Science and Technology, P.O Box AC 939, Ascot Bulawayo, Zimbabwe

    Mlamuli Dhlamini

  2. Department of Applied Science, Maulana Abul Kalam Azad University of Technology, Kolkata, West Bengal, 741249, India

    Hiranmoy Mondal

  3. School of Mathematics, Statistics and Computer Science, University of KwaZulu-Natal, Pietermaritzburg, 3209, South Africa

    Precious Sibanda

  4. Department of Mathematics, University of Swaziland, Private Bag 4 K, Waluseni, Swaziland

    Sandile Motsa

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  1. Mlamuli Dhlamini
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  4. Sandile Motsa
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Contributions

Mlamuli Dhlamini, Hiranmoy Mondal, prepared original drafts of the research article and also write the methodology. Using the software validate our results. Prof. Sibanda and Prof. Motsa edited and review of our article

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Correspondence to Hiranmoy Mondal.

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Dhlamini, M., Mondal, H., Sibanda, P. et al. Numerical Analysis of Couple Stress Nanofluid in Temperature Dependent Viscosity and Thermal Conductivity. Int. J. Appl. Comput. Math 7, 48 (2021). https://doi.org/10.1007/s40819-021-00983-x

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