Summary
Tungsten films on polycrystalline copper are considered as possible material systems for high heat flux components in fusion reactors like the International Thermonuclear Experimental Reactor (ITER). Since high thermal loads will occur at the reactor wall it is necessary to analyse temperature-induced stress evolution and possible microstructural changes. In this study the thermal stresses in tungsten films with different thicknesses are characterized by advanced in-situ X-ray diffraction techniques including synchrotron scattering. The microstructure and stress behaviour are critically discussed.
Zusammenfassung
Wolfram-Schichten auf Kupfer stellen ein mögliches Materialsystem für Anwendungen in Fusionsreaktoren wie dem International Thermonuclear Experimental Reactor ITER dar. Da die Schichten beträchtlichen thermischen Belastungen ausgesetzt sein werden, ist es von großem Interesse, die Entwicklung thermischer Spannungen und die Änderungen der Mikrostruktur zu analysieren. Zu diesem Zweck wurden in dieser Arbeit die thermischen Spannungen mittels moderner röntgenographischer Methoden, die unter anderem auch am Berliner Synchrotron ausgeführt wurden, charakterisiert und unter Berücksichtigung der Mikrostruktur kritisch diskutiert.
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Kapp, M., Martinschitz, K., Keckes, J. et al. Thermal Stresses and Microstructure of Tungsten Films on Copper. Berg Huettenmaenn Monatsh 153, 273–277 (2008). https://doi.org/10.1007/s00501-008-0389-y
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DOI: https://doi.org/10.1007/s00501-008-0389-y