Skip to main content
Log in

Soft X-ray lithography of high aspect ratio SU8 submicron structures

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

SU8 submicron structures with an aspect ratio of more than 50 are made by soft X-ray lithography using modified spectra of the synchrotron radiation at the ANKA LITHO-1 beamline, which includes a chromium mirror. The X-ray spectrum is additional shaped by a beam stop and a filter to a narrow band in order to reduce the influence of diffraction and photoelectrons. The exposure determination is based on the measured threshold doses for used SU-8 resist layers as well as on the calculated diffractive distribution of an absorbed power. Post-exposure bake of the resist is performed at low temperature and low pressure to avoid changes of the structural size because of shrinkage due to temperature changes and to eliminate a “skin” layer at the top of the resist. SU8 structures with lateral dimensions of 1 μm and heights from 50 to 80 μm have been fabricated defect free with the optimized process.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  • ANKA Instrumentation Book (2006) In: Baumbach T, Goettlicher J, Hagelstein M (eds) ANKA Angstroemquelle Karlsruhe, Institute for Synchrotron Radiation, Forschungszentrum Karlsruhe GmbH. http://ankaweb.fzk.de/_file/extras/extras_download_3.pdf

  • Ehrfeld W, Muenchmeyer D (1991) Three-dimensional microfabrication using synchrotron radiation. Nucl Instrum Methods Phys Res A 303:523–531

    Article  Google Scholar 

  • Feiertag G, Ehrfeld W, Lehr H, Schmidt A, Schmidt M (1997) Calculation and experimental determination of the structure transfer accuracy in deep X-ray lithography. J Micromech Microeng 7:23–331

    Article  Google Scholar 

  • Feldman M, Sun J (1992) Resolution limits in X-ray lithography. J Vac Sci Technol B10:3173–3176

    Google Scholar 

  • Grün AE (1957) Lumineszenz-photometrische Messungen der Energieabsorption im Strahlungsfeld von Elektronenquellen. Eindimensionaler Fall in Luft. Z Naturforsch 12A:89–95

    Google Scholar 

  • Handbook of physics (1967) In: Condon EU, Odishaw H (eds) 2nd edn. McGraw-Hill, New York

  • Mappes T, Achenbach S, Mohr J (2007) Process conditions in X-ray lithography for the fabrication of devices with sub-micron features sizes. Microsyst Technol 13:355–360

    Article  Google Scholar 

  • Megtert S, Pantenburg FJ, Achenbach S, Kupka R, Mohr J, Roulliay M (1999) Preliminary results on the use of mirrors for LIGA process. Proc SPIE 3680:917–923

    Article  Google Scholar 

  • Menz W, Mohr J (1997) Microsystemtechnik fuer Ingenieure. VCH A Wiley Cmpany, Weinheim

    Google Scholar 

  • Müller C, Mohr J (1993) Microspectrometer fabricated by the LIGA-Process. Interdiscip Sci Rev 18:273–279

    Google Scholar 

  • Nazmov V, Reznikova E, Mohr J, Snigirev A, Snigireva I, Achenbach S, Saile V (2004a) Fabrication and preliminary testing of X-ray lenses in thick SU-8 resist layers. Microsyst Technol 10:716–721

    Article  Google Scholar 

  • Nazmov V, Reznikova E, Somogyi A, Mohr J, Saile V (2004b) Planar sets of cross X-ray refractive lenses from SU-8 polymer. Proc SPIE 5539:235–243

    Article  Google Scholar 

  • Nazmov V, Reznikova E, Mohr J (2005) Investigation of radiation-induced thermal flexure of X-ray lithography mask during tilted exposure. In: Book of abstracts of high aspect ratio micro structure technology workshop, Gyeongju, Korea, pp 130–131

  • Pantenburg F, Mohr J (1995) Influence of secondary effects on structure quality in deep X-ray lithography. Nucl Instrum Methods Phys Res B 97:551–556

    Article  Google Scholar 

  • Perennes F, Pantenburg FJ (2001) Adhesion improvement in deep X-ray lithography process using a central beam-stop. Nucl Instrum Methods Phys Res B 174:317–323

    Article  Google Scholar 

  • Reznikova E, Nazmov V, Mohr J (2002) Deep X-ray lithography characteristics of SU-8 photo-resist. In: Digest reports of the XIV Russian Synchrotron radiation conference (SR-2002), July 15–19, Novosibirsk, Russia, p 137

  • Reznikova E, Mohr J, Hein H (2005a) Deep photo-lithography characterization of SU-8 resist layers. Microsyst Technol 11:282–291

    Article  Google Scholar 

  • Reznikova E, Nazmov V, Mohr J (2005b) Characterization of pre- and post-exposure baking for ultra-deep X-ray lithography with SU-8 resist. In: Book of abstracts of high aspect ratio micro structure technology workshop (HARMST-2005), Gyeongju, Korea, pp 78–79

Download references

Acknowledgments

The authors would like to thank Siemens AG (Dr. E. Hempel) for partly funding the research work, Dr. Ch. David (Paul Scherrer Institute, Switzerland) for discussion of the results, Dr. T. Mappes (Institute of Microstructure Technology/FZK, Germany) for a discussion about optimal doses for E-beam lithography exposure of PMMA and to Dr. F.-J. Pantenburg (Institute of Microstructure Technology/FZK, Germany) for his introduction about operating peculiarities at the LITHO-1 station.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Elena Reznikova.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Reznikova, E., Mohr, J., Boerner, M. et al. Soft X-ray lithography of high aspect ratio SU8 submicron structures. Microsyst Technol 14, 1683–1688 (2008). https://doi.org/10.1007/s00542-007-0507-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-007-0507-x

Keywords

Navigation