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Energy based model to assess interfacial adhesion using a scratch test

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Abstract

A common way to improve the scratch resistance of a sensitive surface is to coat it with a thin film. However, the substrate/thin film adhesion must be well controlled and measurable. The contribution of the present work is to propose a global energy balance model of the blistering process for the scratching of a substrate/thin film system, which permits one to determine the adhesion of the system. The adhesion can be measured by following the delaminated area as a function of the scratching distance during blistering. The particular case of an experimental stable blistering process was studied and the corresponding substrate/thin film adhesion was derived using the global energy balance model.

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Abbreviations

V tip :

Scratching velocity

F n , F t :

Normal and tangential loads respectively

T :

Temperature

ΔW :

Work provided by the loading indenter

ΔEF :

Fracture energy

ΔED :

Energy released in dissipative phenomena other than fracture

ΔEE :

Elastic energy

d :

Scratching distance

µ app :

Apparent friction coefficient

µ local :

Local friction coefficient

ΔAinterf. :

Surface created at the interface

ΔAcoh. :

Surface created within the material

γ s−interf. :

Surface energy required to create 1 unit of interfacial new surface

γ s−coh. :

Surface energy required to create 1 unit of cohesive new surface

δW D :

Dissipative work (fracture excluded) per unit of scratching distance

δW E :

Elastic work per unit of scratching distance

δW DP :

Plastic deformation work of the system per unit of scratching distance

δW DF :

Work due to the true local friction

σ y :

Yield stress of the substrate

S t :

Cross section of the plastic zone in the scratching track left on the surface

ΔAB :

Area of the blister

p atm :

Atmospheric pressure

\( \overline {h_{{\text{a}}} } \) :

Average height of the blister

ΔA :

Delaminated area variation

Δd :

Scratching distance variation

W idth :

Width of the blister as defined in Fig. 1

R :

Radius of curvature of the indenter tip

a :

Contact radius

e :

Thickness of the film

L g :

Width of the groove

\( \dot \varepsilon \) :

Strain rate

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Acknowledgement

The authors would like to thank C. Robert for his preliminary experimental work.

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Authors and Affiliations

  1. Institut Charles Sadron (I.C.S.), CNRS UPR 022, 23 rue du Loess, BP 84047, 67034, Strasbourg cedex 2, France

    Vincent Le Houérou, Christian Gauthier & Robert Schirrer

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  1. Vincent Le Houérou
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  2. Christian Gauthier
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  3. Robert Schirrer
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Correspondence to Vincent Le Houérou.

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Le Houérou, V., Gauthier, C. & Schirrer, R. Energy based model to assess interfacial adhesion using a scratch test. J Mater Sci 43, 5747–5754 (2008). https://doi.org/10.1007/s10853-008-2869-6

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  • DOI: https://doi.org/10.1007/s10853-008-2869-6

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