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Conductive Polyaniline for Potential Application in Anisotropic Conductive Films

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Abstract

Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

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Authors and Affiliations

  1. Information Display Device Laboratory, Department of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul, 120-749, Republic of Korea

    Yong-Seok Ha, Hong-Gyu Park & Dae-Shik Seo

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  1. Yong-Seok Ha
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  2. Hong-Gyu Park
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  3. Dae-Shik Seo
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Correspondence to Dae-Shik Seo.

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Ha, YS., Park, HG. & Seo, DS. Conductive Polyaniline for Potential Application in Anisotropic Conductive Films. J. Electron. Mater. 44, 1200–1205 (2015). https://doi.org/10.1007/s11664-014-3612-5

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  • DOI: https://doi.org/10.1007/s11664-014-3612-5

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