Abstract
Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway.
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References
Z. Han and A. Fina, Prog. Polym. Sci., 36, 914 (2011).
M. Bozlar, D. He, J. Bai, Y. Chalopin, N. Mingo, and S. Volz, Adv. Mater., 22, 1654 (2010).
M. T. Barako, A. Sood, C. Zhang, J. Wang, T. Kodama, M. Asheghi, X. Zheng, P. V. Braun, and K. E. Goodson, Nano Lett., 16, 2754 (2016).
H. Chen, V. V. Ginzburg, J. Yang, Y. Yang, W. Liu, Y. Huang, L. Du, and B. Chen, Prog. Polym. Sci., 59, 41 (2016).
N. Burger, A. Laachachi, M. Ferriol, M. Lutz, V. Toniazzo, and D. Ruch, Prog. Polym. Sci., 61, 1 (2016).
Z. Pang, X. Gu, Y. Wei, R. Yang, and M. S. Dresselhaus, Nano Lett., 17, 179 (2017).
A. M. Marconnet, N. Yamamoto, M. A. Panzer, B. L. Wardle, and K. E. Goodson, ACS Nano, 5, 4818 (2011).
H. Jung, S. Yu, N.-S. Bae, S. M. Cho, R. H. Kim, S. H. Cho, I. Hwang, B. Jeong, J. S. Ryu, J. Hwang, S. M. Hong, C. M. Koo, and C. Park, ACS Appl. Mater. Interfaces, 7, 15256 (2015).
K. M. F. Shahil, and A. A. Balandin, Nano Lett., 12, 861 (2012).
S. H. Song, K. H. Park, B. H. Kim, Y. W. Choi, G. H. Jun, D. J. Lee, B.-S. Kong, K.-W. Pail, and S. Jeon, Adv. Mater., 25, 732 (2012).
C. Yuan, B. Duan, L. Li, B. Xie, M. Huang, and X. Luo, ACS Appl. Mater. Interfaces, 7, 13000 (2015).
X. Juang, C. Zhi, P. Jiang, D. Golberg, Y. Bando, and T. Tanaka, Adv. Funct. Mater., 23, 1824 (2013).
J. R. Choi, S. Yu, H. Jung, S. K. Hwang, R. H. Kim, G. Song, S. H. Cho, I. Bae, S. M. Hong, C. M. Koo, and C. Park, Nanoscale, 7, 1888 (2015).
D. Suh, C. M. Moon, D. Kim, and S. Baik, Adv. Mater., 28, 7220, (2016).
K. Pashayi, H. R. Fard, F. Lai, S. Iruvanti, J. Plawsky, and T. Borca-Tasciuc, J. Appl. Phys., 111, 104310 (2012).
S. Yu, J.-W. Lee, T. H. Han, C. Park, Y. Kwon, S. M. Hong, and C. M. Koo, ACS Appl. Mater. Interfaces, 5, 11618 (2013).
I. Seshadri, G. L. Esquenazi, T. Borca-Tasciuc, P. Keblinski, and G. Ramanath, Adv. Mater. Interfaces, 2, 1500186 (2015).
Z. Lin and V. Zhigilei, Phys. Rev. B, 77, 075133 (2008)
G. Wiedemann and R. Franz, Ann. Phys., 89, 497 (1853).
D. D. Edie, Carbon, 37, 345 (1998).
S. Han, J. T. Lin, Y. Yamada, and D. D. L. Chung, Carbon, 46, 1060 (2008).
S. Han, and D. D. L. Chung, Compos. Sci. Technol., 71, 1944 (2011).
R. Taipalus, T. Harmia, M. Q. Zhang, and K. Friedrich, Compos. Sci. Technol., 61, 801 (2001).
L. Qiu, X. H. Zheng, J. Zhu, G. P. Su, and D. W. Tang, Carbon, 51, 265 (2013).
H. A. Katzman, P. M. Adams, T. D. Le, and C. S. Hemminger, Carbon, 32, 379 (1994).
A. Dasgupta and R. K. Agarwal, J. Compos. Mater., 26, 2736 (1992).
Q.-G. Ning and T.-W. Chou, J. Compos. Mater., 29, 2280 (1995).
U. I. Thomann, M. Sauter, and P. Ermanni, Compos. Sci. Technol., 64, 1637 (2004).
I. J. Turias, J. M. Gutierrez, and P. L. Galindo, Compos. Sci. Technol., 65, 609 (2005).
H. Hatta and M. Taya, J. Appl. Phys., 58, 2478 (1985).
J. R. Gaier, Y. Y. Vandenberg, S. Berkebile, H. Stueben, and F. Balagadde, Carbon, 41, 2187 (2003).
G. E. Youngblood, D. J. Senor, R. H. Jones, and S. Graham, Compos. Sci. Technol., 62, 1127 (2002).
Q.-G. Ning and T.-W. Chou, Compos. Part A, 29A, 315 (1998).
H. Hatta and M. Taya, Int. J. Eng. Sci., 24, 1159 (1986).
J. Schuster, D. Heider, and K. Sharp, Compos. Sci. Technol., 68, 2085 (2008).
Y. M. Shabana and N. Noda, Int. J. Solids Struct., 45, 3494 (2008).
T. Hara, S. Kamijima, and Y. Shimura, Electrochem. Solid-State Lett., 6, C8 (2003).
J.-L. Auriault and H. I. Ene, Int. J. Heat Mass Transfer, 37, 2885 (1994).
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Acknowledgments: This work was supported by a grant from Fundamental R&D Program for Core Technology of Materials and Industrial Strategic Technology Development Program funded by the Ministry of Trade, Industry and Energy, Republic of Korea and was partially supported by the Korea Institute of Science and Technology (KIST) and the research fund of Hanyang University (HY-2013). This research was also supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning.
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Yu, S., Park, K., Lee, JW. et al. Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites. Macromol. Res. 25, 559–564 (2017). https://doi.org/10.1007/s13233-017-5114-9
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DOI: https://doi.org/10.1007/s13233-017-5114-9