Magnetic field assisted abrasive based micro-/nano-finishing

https://doi.org/10.1016/j.jmatprotec.2009.08.015Get rights and content

Abstract

Micro-/nano-machining (abbreviated as MNM) processes are classified mainly in two classes: traditional and advanced. Majority of the traditional MNM processes are embedded abrasive or fixed geometry cutting tool type processes. Conversely, majority of the advanced MNM processes are loose flowing abrasive based processes in which abrasive orientation and its geometry at the time of interaction with the workpiece is not fixed. There are some MNM processes which do not come under the abrasive based MNM category, for example, laser beam machining, electron beam machining, ion beam machining, and proton beam machining. This paper gives a comprehensive overview of various flowing abrasive based MNM processes only. It also proposes a generalized mechanism of material removal for these processes. The MNM processes discussed in this paper include: Abrasive Flow Finishing (AFF), Magnetic Abrasive Finishing (MAF), Magnetorheological Finishing, Magnetorheological Abrasive Flow Finishing, Elastic Emission Machining (EEM) and Magnetic Float Polishing. EEM results in surface finish of the order of sub-nanometer level by using the nanometer size abrasive particles with the precisely controlled forces. Except two (AFF and EEM), all other processes mentioned above use a medium whose properties can be controlled externally with the help of magnetic field. This permits to control the forces acting on an abrasive particle hence the amount of material removed is also controlled. This class of processes is capable to produce surface roughness value of 8 nm or lower. Using better force control and still finer abrasive particles, some of these processes may result in the sub-nanometer surface roughness value on the finished part. Understanding the mechanism of material removal and rotation of the abrasives in these processes will help in rationalization of some of the experimental observations which otherwise seem to be contradicting with the established theories. It also explains why a magnet used in MAF should have a slot in it even though the area under the slot has “non-machining” zone. It elaborates based on the experimental observations why to use pulse D.C. power supply in MAF in place of smooth D.C. power supply.

Introduction

Fabrication of products deals with the building of machines, structures or process equipment by cutting, shaping, welding and assembling of components made of the same or different materials. Fabrication can be classified into two main categories: macro-fabrication and micro-fabrication. The first one considers the process of fabrication of structures/parts/products/features that are measurable and observable by naked eye (≥1 mm in size) while the second category deals/considers the miniature structures/parts/products/features which are not easily visible with naked eye, and have dimensions smaller than 1 mm (1 μm  dimension  999 μm). There are various methods/ways by which micro-fabrication of products can be achieved (Fig. 1). However, two of them are the most commonly used: (1) material deposition, and (2) material removal. This article deals with the material removal processes only. Some of the traditional material removal processes can be used for micro-fabrication. However, they have some constraints hence advanced material removal processes are more commonly used for this purpose. Fig. 2(a) shows a classification of advanced micro-/nano-machining (MNM) and micro-/nano-finishing (MNF) processes.

Majority of the advanced material removal processes can be employed for both, macro-machining as well as for micro-machining. While scaling down the applications of a process from macro- to micro (μ)-machining, the μ-machining process parameters have to be appropriately changed. Further, advanced micro-machining processes (abbreviated as AMMPs) are used for two main purposes: (i) shaping and sizing a part, (ii) finishing a part. For differentiating between these two classes, the first one is called as AMMPs and the second one as advanced micro-/nano-finishing processes (AMNFPs). The AMMPs can be further sub-categories as (i) those processes which use abrasive particles as tools for removing material from the work piece in the form of micro-/nano-chips, and (ii) those processes which use direct energy for removal of material by melting and/or vaporization, or electrochemical or chemical reaction (Fig. 2(a)). The AMMPs deal with fabrication of microstructures, generation of micro-features (say, micro-grooves, micro-cavity, micro-channels, etc. [Jain, 2009]).

This paper deals only with those processes which fall in the category of abrasive based micro-/nano-finishing processes. Some of the abrasive based advanced (micro-/nano-finishing) and traditional finishing processes are given in Fig. 2(b).

Section snippets

Abrasive based advanced micro-/nano-finishing processes

In today's advanced engineering industries, the designers’ requirements on the components are stringent, for example, extraordinary properties of materials, complex shaped 3D components (Fig. 3(a, i–iv)), miniature features, nano-level surface finish on complex geometries which are not feasible to achieve by any traditional methods (say, thousands of turbulated cooling holes in a turbine blade, Fig. 3(a, iv), making and finishing of micro-fluidic channels in the electrically non-conducting

Analysis of selected abrasive based nano-finishing processes

Modeling and theoretical analysis of the selected abrasive based nano-finishing processes have been carried out to explain some of the results obtained during experimentation. These results have not been satisfactorily explained in the existing literature.

Conclusions

From the presented experimental results and analysis, following conclusions can be drawn:

  • Each of the nano-finishing process is characterized by its ultimate (or critical) surface finish (normally varies in a small band) which can be produced by that process, and it depends on the finishing conditions used during the process.

  • During PC-MAF, use of low duty cycle is recommended but the surface integrity should be carefully examined for the defects such as deep scratches, pits, etc. Increase in

Acknowledgements

Author acknowledges the invitation by Prof. Ian Hutching, Chairman of 1st International Conference on Abrasive Based Processes, to give an invited talk on “Abrasive Based Micro-/Nano-Finishing Techniques—An overview”. The author sincerely thanks Mr. Ajay Sidpara, Ph.D. Scholar of Mechanical Engineering Department, IIT Kanpur for his help in the preparation of this manuscript. Thanks are also due to Dr. D.K. Singh of M.M.M. Engg. College, Gorakhpur; Dr. Sunil Jha of I.I.T. Delhi for sharing

References (62)

  • J.D. Kim

    Development of a magnetic abrasive jet machining system for internal polishing of circular tubes

    Journal of Material Processing Technology

    (1997)
  • R. Komanduri et al.

    Technological advances in fine abrasive processes

    Annals of CIRP

    (1997)
  • R. Komanduri

    On material removal mechanisms in finishing of advanced ceramics and glasses

    Annals of CIRP

    (1996)
  • Y. Liu et al.

    Investigation on the final polishing slurry and technique of silicon substrate in ULSI

    Microelectronic Engineering

    (2003)
  • Y. Mori et al.

    Elastic emission machining

    Precision Engineering

    (1987)
  • L.J. Rhoades

    Abrasive flow machining: a case study

    Journal of Materials Processing Technology

    (1991)
  • N. Saka et al.

    Nano-scale scratching in chemical–mechanical polishing

    CIRP Annals-Manufacturing Technology

    (2008)
  • D.K. Singh et al.

    Analysis of surface texture generated by a flexible magnetic abrasive brush

    Wear

    (2005)
  • Y. Tani et al.

    Development of high-efficient fine finishing process using magnetic fluid

    Annals of CIRP

    (1984)
  • V.C. Venkatesh et al.

    Observation on polishing and ultra precision machining of semiconductor substrate materials

    Annals of CIRP

    (1995)
  • G. Wenski et al.

    Double side polishing—a technology mandatory for 300 mm wafer manufacturing

    Materials Science in Semiconductor Processing

    (2002)
  • H. Yamaguchi et al.

    Internal finishing process for alumina ceramic components by a magnetic field assisted finishing process

    Precision Engineering

    (2004)
  • J.D. Carlson et al.

    Commercial magnetorheological fluid devices

    International Journal of Modern Physics B

    (1996)
  • C.Y. Chang et al.

    Fabrication of thin film transistors by chemical mechanical polished polycrystalline silicon films

    IEEE Electron Device Letters

    (1996)
  • E.M. Furst et al.

    Micromechanics of magnetorheological suspensions

    Physical Review E

    (2000)
  • J.M. Ginder et al.

    Shear stresses in magnetorheological fluids: role of magnetic saturation

    Applied Physics Letters

    (1994)
  • Y. Hayashi et al.

    Ultrauniform Chemical Mechanical Polishing (CMP) using a Hydro Chuck, featured by wafer mounting on a quartz glass plate with fully flat water supported surface

    Japanese Journal of Applied Physics

    (2001)
  • V.K. Jain

    Advanced Machining Processes

    (2002)
  • V.K. Jain

    Introduction to Micromachinnig

    (2009)
  • R.K. Jain et al.

    Simulation of surface generated in abrasive flow finishing process

    Robotics and Computer Integrated Manufacturing

    (1999)
  • V.K. Jain et al.

    Evaluation of rheological properties of medium for AFM process

    Machining Science and Technology

    (2001)
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