Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
Section snippets
Acknowledgements
The authors thank the Air Force Research Laboratory Sensors Directorate device team of R.C. Fitch, J.K. Gillespie, G.H. Jessen, D. Langley, and G.D. Via for experimental data used for model validation as well as D. Dorsey and C. Bozada for advice and for a critical reading of this manuscript and J. Theimer, K.D. Leedy, G.D. Via and S. Motakef for several helpful discussions.
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