Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles’ size and volume fraction

doi:10.1016/j.msea.2010.11.006

Materials Science and Engineering: A

Volume 528, Issue 3, 25 January 2011, Pages 1740-1749

https://doi.org/10.1016/j.msea.2010.11.006 Get rights and content

Abstract

In this experiment, copper-base composites reinforced with 30 nm and 5 μm SiC particles are fabricated on the surface of a purecopper sheetvia friction stir processing (FSP). Microstructure, mechanical properties and wear resistance of friction stir processed (FSPed) materials are investigated as a function of volume fraction of SiC particles. Results show that, applying FSP, without SiC particles, increases the percent elongation significantly (more than 2.5 times) and decreases copper's strength. Adding micro- and nano-sized SiC particles decreases the tensile strength and percent elongation. Increasing the volume fraction or decreasing the reinforcing particle size enhances the tensile strength and wear resistance and lowers the percent elongation.

Research highlights

▶ Friction stir processing (FSP) increases the percent elongation significantly. ▶ FSP with SiC particles decreases the percent elongation significantly. ▶ Presence of nano-sized SiC particles changes the fracture mechanism. ▶ Fracture mechanism in the specimen with micro-sized SiC particles is ductile–brittle. ▶ Adding nano-sized SiC particles enhances the wear resistance of the composite.

Introduction

Recently, there has been a great demand for high-strength, high-wear-resistance and high-conductivity connector materials with rapid advancement in the electronic industries [1]. Pure copper is used in many industries because of its high thermal and electrical conductivity, plasticity, softness and formability. Although pure copper is mostly used in electrical applications, it has a key role to play in energy efficiency and provides durable maintenance-free structures that are naturally good looking, long lasting and fully recyclable. However, excessively high softness besides low hardness and wear resistance of pure copper limit its structural applications.

A considerable number of reports have been published on the unconventional mechanical behavior of ultrafine grained materials as a result of extremely high density of grain boundary area [1], [2], [3], [4]. It is proved that the mechanical deficiencies can be improved by grain refinement. There are varied techniques used for achieving fine grained materials directly in bulk form. Of these techniques, severe plastic deformation (SPD) is the commonest [5].

Metal matrix composites (MMCs) are a new class of materials that exhibit good wear resistance and high hardness [6]. Since the wear resistance and hardness are the surface properties rather than bulk properties, if the reinforcing particles are added to the surface layer instead of bulk, wear resistance and surface hardness can be improved without sacrificing the bulk properties [6], [7]. In terms of grain refinement and particle strengthening, two microstructure parameters are critical. One is the particle interspacing L, which can be roughly estimated from L = r × (2π/3V_f)^1/2;where r is the average particle radius and V_f is the particle volume fraction. The other is Zener–Hollomon parameter. Assuming a completely uniform distribution of reinforcing particles, the Zener–Hollomon parameter (d_z) can be calculated by d_z = 4r/(3V_f); where r and V_f are the radius and volume fraction of reinforcing particles, respectively [6]. Concerning the cited relations, it can be concluded that either increasing the volume fraction or decreasing the radius of reinforcing particles decreases both matrix grain size and particle interspacing.

Owing to excellent electrical and thermal conductivity, high hardness values, and good wear and frictional properties, Cu/SiC MMCs have been widely studied [8], [9], [10], [11]. Powder sintering, squeeze casting, composite electroforming technology and sintering under ultra-high pressure are the methods mostly used for fabricating these composites [8], [10], [12], [13], [14].

Friction stir processing (FSP) based on friction stir welding is a solid-state technique used for material processing in order to modify microstructural and mechanical properties. Also, it is possible to produce a surface composite layer by this process [15], [16].

In spite of several investigations done on the FSP of other metals, there is no document about friction stir processing of pure copper. In the present work, FSP has been employed to modify the surface properties of pure copper and Cu/SiC surface composite layer was fabricated using micro- and nano-sized SiC particles. Effects of size and volume fraction of SiC particles on mechanical properties of the composite have been investigated.

Section snippets

Experimental procedure

The material used in this work was a pure copper plate, 130 mm in length, 60 mm in width and 6 mm in thickness. In order to produce surface composite layers, 5 μm and 30 nm SiC particles were contrived in a groove plowed in the middle of the specimens’ surface. In order to change the volume fraction of SiC particles the grooves with different depths (0.6, 1.2 and 1.8 mm) were chosen. The grooves width was 1 mm. The optimum rotational and traverse speeds, resulting in the best powder distribution, were

Results and discussion

Fig. 2 shows the SEM cross section macrograph of the specimen FSPed with SiC particles. The thickness of composite layer is about 2 mm which is limited to the height of the pin.

Conclusions

In this work, we presented a detailed study on microstructural, mechanical and wear properties of Cu/SiC composites produced by dispersing 5 μm and 30 nm SiC particles in the surface layer of the pure cupper through friction stir processing. The following conclusions can be drawn from the results obtained:

1.
The grain size of fabricated composite layers with both micro- and nano-particles was considerably less than that of the FSPed specimen with no particles. In constant volume fraction, decreasing

Acknowledgment

Iranian Nanotechnology Initiative is gratefully appreciated for partial financial support.

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Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles’ size and volume fraction

Abstract

Research highlights

Introduction

Section snippets

Experimental procedure

Results and discussion

Conclusions

Acknowledgment

Scripta Mater.

Scripta Mater.

Scripta Mater.

Scripta Mater.

Mater. Sci. Eng. A

Mater. Des.

Mater. Des.

Mater. Lett.

Mater. Des.

Mater. Sci. Eng. A

J. Nucl. Mater.

Composites A

Acta Mater.

J. Mater. Process. Tech.

Mater. Sci. Eng. R

Scripta Mater.

Mater. Lett.