Design and performance of the ABCD3TA ASIC for readout of silicon strip detectors in the ATLAS semiconductor tracker
Introduction
The Semiconductor Tracker (SCT) together with the Pixel Detector and the Transition Radiation Tracker (TRT) form the Inner Detector (ID) system in the ATLAS experiment being built for the Large Hadron Collider (LHC) at the CERN laboratory [1]. The SCT is built of double-sided modules, each one consisting of two pairs of daisy chained silicon strip sensors. The strips on the two sides are tilted by a small stereo angle of 40 Mrad, which provides the third space coordinate with a moderate resolution, i.e. z in the barrel part and r in the endcap parts. In the barrel part the strips are 12.8-cm long with a constant pitch of 80 μm. In the endcap discs of the SCT there are five different designs of the silicon strip sensor used. The electrical parameters of the barrel and the endcap sensors are very similar and the same front-end electronics can be used for the sensor of each type.
Each module comprises 1536 strips to be read out by means of 12 128-channel front-end ASICs, which are assembled into a hybrid circuit and attached to the sensor assembly. The complete SCT detector will consist of 4088 silicon strip detector modules comprising approximately 6.3 million readout channels.
There are two aspects that influence strongly the design of all components of the SCT, and of the front-end ASIC in particular, namely the bunch crossing frequency in the LHC of 40 MHz and the required radiation resistance. The design specifications for the SCT front-end electronics, assuming 10-year operation of the LHC at the design luminosity scenario, are: 10 Mrad of total ionising dose and 2×1014 n/cm2 of 1-MeV neutron equivalent fluence, including 50% uncertainty. The front-end ASIC must maintain the specified performance parameters after irradiation up to the above total ionising dose and 1-MeV equivalent fluence. In order to meet these requirements a special radiation hard integrated circuit technology has to be used.
The moderate spatial resolution requirement of the SCT can be achieved with strip pitch of 80 μm and binary readout architecture that guarantees resolution of 23 μm rms. The main advantage of the binary readout system is a drastic reduction of data to be read out as only addresses of channels that have recorded hits above the threshold are transmitted off the detector. For a big tracking system like the SCT this is an important aspect resulting in lower cost, a reduction of the material required for the data transmission system, and simplified off-detector readout electronics. On the other hand, in order to perform data sparsification in the front-end electronics a very robust front-end readout system is required. Besides the usual requirements concerning noise, speed and power dissipation, the channel-to-channel matching of gain, and discriminator threshold become very critical issues.
Another aspect, particularly important for the binary readout architecture, is the immunity of the overall system, and so of each component of the system, to external and internal interference, usually referred to as common mode noise. If one takes into account irreducible noise sources present in the front-end system, i.e. the parallel and series noise sources of the preamplifier and the shot noise of the detector leakage current, an achievable signal-to-noise ratio is about 15 at the beginning of the experiment and about 10 after irradiation of silicon strip detectors and front-end electronics up to the levels as expected after 10 years of LHC operation. With these signal-to-noise ratios there is very little room for setting the discrimination threshold in such a way that the detector is fully efficient and the noise occupancy is much lower than the physical data rate. Thus, any degradation of the signal-to-noise ratio will lead to either a drastic reduction of efficiency or increase of noise occupancy.
The ABCD3TA design is a single chip implementation of the binary readout architecture using the DMILL technology—a radiation resistant BiCMOS process comprising CMOS devices with 0.8 μm minimum gate length and bipolar devices with the cut-off frequency of 5 GHz. The final design is an outcome of several prototyping steps. The actual implementation of the required architecture and functionality depends strongly on the available technological options. At the beginning of the project a version based on two separate chips: CAFE [2]—a front-end chip realised in the MAXIM bipolar process and ABC [3]—a binary pipeline chip realised in the Honeywell bulk CMOS process, have been developed. The DMILL process [4], which became available at a later stage, permits combining all required functionality in a single chip. The ABCD3TA design follows closely the first prototype developed in the DMILL process, the SCT128B chip [5].
The first ABCD prototype chip met most of the requirements, however, the spread of the discriminator threshold in the front-end exceeded the acceptable level. Analysis of the problem led us to a conclusion that given the matching parameters of the DMILL technology we could not achieve the required performance following the original circuit concept. Therefore, the design was upgraded and in the ABCD2T chip threshold correction on a channel basis was implemented by adding a 4-bit digital-to-analogue converter (TrimDAC) per channel [6], [7]. Extensive radiation testing performed for that prototype showed that matching performance degraded significantly after irradiation. In particular, after proton irradiation up to the full fluence the discriminator offset spread exceeded the range of the TrimDAC. Therefore, in the final version ABCD3TA the TrimDAC range adjustment was added to ensure that the offset spread is covered even in the case of a very large increase after irradiation, up to a factor of 5.
Section snippets
Basic functionality
The ABCD3TA chip must provide all functions required for processing signals from 128 strips of a silicon strip detector and transmitting data off the detector module in the SCT. The basic functions are the following:
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charge integration,
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pulse shaping,
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amplitude discrimination,
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latching data either in the edge sensing mode or in the level sensing mode,
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storage of data in the pipeline for the first level (L1) trigger latency,
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derandomisation and compression of data,
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transmission of data from the chip
Overview of the ABCD3TA design
The block diagram of the ABCD3TA chip is shown in Fig. 1. It comprises all blocks of the binary readout architecture, the front-end circuitry, discriminators, binary pipeline, derandomising buffer, data compression logic and the readout control logic.
The preamplifier-shaper circuit delivers signals with peaking time of 25 ns. This peaking time is sufficient for keeping the discriminator timewalk within the range of 16 ns and the double pulse resolution below 50 ns. It also provides a reasonable
Design for large volume production
The full SCT requires 49,056 conforming ASICs, not counting the spares. Obviously, given the requirements for the overall efficiency of the SCT to be better than 99%, use of any out-of-spec chips would result in a degradation of the tracking performance of the ATLAS detector. In addition some losses are unavoidable through the full construction process. A loss model was established for losses that may occur in various steps starting from receiving the wafers from the foundry, through wafer saw,
Module performance
Requirements for the analogue parameters and characteristics of the ABCD3TA ASICs are specified for given parameters of the silicon strip detectors. Therefore, the performance of the ASICs should be validated by demonstrating that the requirements are met for a fully loaded module designed according to the SCT specification. It is important to note that some design aspects can be demonstrated only in the final fully loaded modules. This applies in particular to parameters like phase margin of
Radiation effects
The detector together with its readout electronics will be located close to the interaction point and so exposed to high levels of radiation. The highest accumulated radiation levels expected in the ATLAS SCT after 10 years of operation, including 50% uncertainty, will be 10 Mrad of total ionising dose and a 1 MeV neutron equivalent fluence of 2×1014 n/cm2, causing displacement damage. The ABCD3TA chip is realised in a BiCMOS technology so it is built of MOS transistors, which are primarily
Large volume production
As already stated, the full SCT requires 49,056 conforming ASICs installed but our model for losses in assembly and installation created a requirement for 61,000 good chips. Given the expected yield of 26% based upon the foundry's guarantee, the production plan was made for 961 wafers or roughly 250,000 ICs.
The production plan included the following steps:
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Receipt of wafers from the foundry vendor with visual inspection.
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Full functional test of each IC in wafer form
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Wafer saw and selection of good
Summary
The ABCD3TA ASIC developed for binary readout of silicon strip detectors meets the requirements of the ATLAS SCT. The performance of the chip has been demonstrated through extensive evaluation of the prototypes as well as in the series production of the SCT detector modules.
For a fully populated module built with silicon strip detectors of a total length of 12.8 cm, an ENC below 1500 electrons rms and a noise occupancy below 1×10−4 are systematically achieved. After irradiation up to full SCT
Acknowledgements
We acknowledge the support of the funding authorities of the collaborating institutes including the Australian Research Council; the Australian Department of Education, Science and Training; the Polish State Committee for Scientific Research; the Ministry of Education, Science and Sport of the Republic of Slovenia; the Spanish National Programme for Particle Physics; the Particle Physics and Astronomy Research Council of the United Kingdom; the United States Department of Energy; and the United
References (31)
- et al.
Nucl. Instr. and Meth. A
(1999) Nucl. Instr. and Meth. A
(2002)Nucl. Instr. and Meth. A
(2002)Nucl. Instr. and Meth. A
(1999)Nucl. Instr. and Meth. A
(2001)Nucl. Instr. and Meth. A
(1999)- et al.
Nucl. Instr. and Meth. A
(2000) Nucl. Instr. and Meth. A
(2003)- ATLAS Inner Detector Technical Design Report, CERN/LHCC/97-17, ATLAS TDR 5, vol. 2, 30 April 1997, pp....
- T. Dubbs, et al., The development of the CAFE-P/CAFE-M bipolar chips for the ATLAS Semiconductor Tracker, in:...
IEEE Trans. Nucl. Sci.
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