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Electroless deposition of Ni–B, Co–B and Ni–Co–B alloys using dimethylamineborane as a reducing agent

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Abstract

Fundamental aspects of electroless Ni–B, Co–B and Ni–Co–B alloys have been systematically examined. The composition, crystal structure and deposition rate of the alloys were determined as a function of the concentration of reducing agent (dimethylamineborane) and complexing agents (tartrate, citrate, malonate and succinic acid), bath pH and Ni2+/Co2+ ratio. Changes in the deposition rate and metallurgical features of the alloys induced by the change in plating parameters are discussed, based on electrochemical polarization data and the formation enthalpy of the nickel and cobalt borides.

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References

  1. H. Hotta, K. Suzuki, M. Watanabe and H. Honma, J. Metal Fin. Soc., Jpn 44 (1993) 831.

    Google Scholar 

  2. D. W. Bandrand, Plat. Surf. Finish. 71 (1984) 72.

    Google Scholar 

  3. L. G. Bhatgadde and S. Mahapatra, Metal Finish. 86 (1988) 31.

    Google Scholar 

  4. E. Schmeling, Metalloberflache 41 (1987) 353.

    Google Scholar 

  5. S. Mizumoto, T. Nawafune and K. Matsumoto, J. Metal Fin. Soc., Jpn 41 (1990) 907.

    Google Scholar 

  6. S. Omori and Y. Hashimoto, Powder & Powder Metall. 20 (1973) 80.

    Google Scholar 

  7. K. Koyama and Y. Hasimoto, J. Japan Inst. Metals 53 (1989) 1129.

    Google Scholar 

  8. W. Thomas Evans and M. Schlesinger, J. Electrochem. Soc. 141 (1994) 78.

    Google Scholar 

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Saito, T., Sato, E., Matsuoka, M. et al. Electroless deposition of Ni–B, Co–B and Ni–Co–B alloys using dimethylamineborane as a reducing agent. Journal of Applied Electrochemistry 28, 559–563 (1998). https://doi.org/10.1023/A:1003233715362

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  • DOI: https://doi.org/10.1023/A:1003233715362

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