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Ultrathin Silicon-Compound Barrier Coatings for Polymeric Packaging Materials: An Industrial Perspective

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Plasmas and Polymers

Abstract

Growing demands for increased shelf-life of food products and chemical inertia of the contact surfaces have stimulated development of polymers with improved high-barrier properties. Our objectives in this article are (1) to describe experimental results on Plasma-enhanced chemical vapor deposition (PECVD) and its importance to produce thin layers of inorganic glassy barrier materials for food, pharmaceutical, and organic display applications; (2) despite the thereby greatly enhanced quality of film or rigid packaging material, some residual coating defects result in less-than-perfect gas, moisture and aroma barriers: an innovative technique based on reactive ion etching (RIE) in oxygen plasma is also presented, along with a staining method, which render even sub-μm coating defects visible. Data are shown for oxygen transmission rate on virgin and defective coatings, and the industrial context and applications are presented.

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Authors and Affiliations

  1. Nova-Plasma Inc., Montréal, QC, Canada

    G. Czeremuszkin & M. Latrèche

  2. Department of Engineering Physics and Materials Engineering, Ecole Polytechnique, Montreal, QC, H3C 3A7, Canada

    M. R. Wertheimer & A. S. da Silva Sobrinho

Authors
  1. G. Czeremuszkin
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  2. M. Latrèche
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  3. M. R. Wertheimer
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  4. A. S. da Silva Sobrinho
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Correspondence to M. R. Wertheimer.

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Czeremuszkin, G., Latrèche, M., Wertheimer, M.R. et al. Ultrathin Silicon-Compound Barrier Coatings for Polymeric Packaging Materials: An Industrial Perspective. Plasmas and Polymers 6, 107–120 (2001). https://doi.org/10.1023/A:1011308919705

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