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Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress

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Abstract

Thermal stresses, one of the main causes of interfacial failure between dissimilar materials, arise from different coefficients of linear thermal expansion. Two efficient numerical procedures in conjunction with the finite element method (FEM) for the stress intensity factor (SIF) analysis of interface cracks under thermal stresses are presented. The virtual crack extension method and the crack closure integral method are modified using the superposition method. The SIF analyses of some interface crack problems under mechanical and thermal loads are demonstrated. Very accurate mode separated SIFs are obtained using these methods.

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Authors and Affiliations

  1. Department of Chemical Engineering, Kyushu University, 6-10-1, Hakozaki, Higashi-ku, Fukuoka, 812-8581, Japan

    T. Ikeda

  2. School of Aeronautics and Astronautics, Purdue University, West Lafayette, IN, 47907, USA

    C.T. Sun

Authors
  1. T. Ikeda
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  2. C.T. Sun
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Ikeda, T., Sun, C. Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress. International Journal of Fracture 111, 229–249 (2001). https://doi.org/10.1023/A:1012208409795

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