Skip to main content
Log in

Codeposition and Microstructure of Nickel—SiC Composite Coating Electrodeposited from Sulphamate Bath

  • Published:
Journal of Applied Electrochemistry Aims and scope Submit manuscript

Abstract

Ni–SiC composite coatings were electroplated from a nickel sulphamate solution with a SiC suspension, with and without the addition of monovalent thallium ions. Without thallium ions, the incorporated SiC particles did not modify the columnar grain structure of the nickel matrix. Conversely, the nickel matrix exhibited an equiaxed grain structure; meanwhile, the amount of codeposited SiC was markedly increased by adding thallium ions to the solution. Additionally, the density of lattice defects associated with nickel grains substantially decreased when the columnar grains were replaced by equiaxed grains. These distinct grain structures associated with the various coatings were discussed in terms of the inhibition of nickel electrocrystallization by thallium ions as well as the absorption and reduction of the various ionic species absorbed on the surface of the SiC particles.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. J. Fransaer, J. P. Celis and J. R. Roos, Metal Finish. 91 (June 1993) 97.

    Google Scholar 

  2. K. Helle and F. Walsh, Trans. IMF 75 (1997) 53.

    Google Scholar 

  3. M. Musiani, Electrochim. Acta 45 (2000) 3397.

    Google Scholar 

  4. A. C. Tavares and S. Trasatti, Electrochim. Acta 45 (2000) 4195.

    Google Scholar 

  5. N. Guglielmi, J. Electrochem. Soc. 119 (1972) 1009.

    Google Scholar 

  6. B. J. Hwang and C. S. Hwang, J. Electrochem. Soc. 140 (1993) 979.

    Google Scholar 

  7. G. Maurin and A. Lavanant, J. Appl. Electrochem. 25 (1995) 1113.

    Google Scholar 

  8. O. Berkh, S. Eskin and J. Zahavi, Plat. Surf. Finish. 81 (March 1994) 62.

    Google Scholar 

  9. L. Orlovskaja, N. Periene, M. Kurtinaitiene and S. Surviliene, Surf. Coat. Technol. 111 (1999) 234.

    Google Scholar 

  10. S. K. Kim and H. J. Yoo, Surf. Coat. Technol. 108–109 (1998) 564.

    Google Scholar 

  11. N. K. Shrestha, I. Miwa and T. Saji, J. Electrochem. Soc. 148 (2001) C106.

    Google Scholar 

  12. L. Benea, P. L. Bonora, A. Borello, S. Martelli, F. Wenger, P. Ponthiaux and J. Galland, J. Electrochem. Soc. 148 (2001) C461.

    Google Scholar 

  13. A. F. Zimmerman, D. G. Clark, K. T. Aust and U. Erb, Mater. Lett. 52 (2002) 85.

    Google Scholar 

  14. S. C. Wang and W. C. Wei, Mater. Chem. Phys. 78 (2003) 574.

    Google Scholar 

  15. T. W. Tomaszewski, L. C. Tomaszewski and H. Brown, Plating 56 (1969) 1234.

    Google Scholar 

  16. K. M. Yin and H. J. Hong, Trans. IMF 75 (1997) 35.

    Google Scholar 

  17. J. P. Celis and J. R. Roos, J. Electrochem. Soc. 124 (1977) 1508.

    Google Scholar 

  18. J. R. Roos, J. P. Celis and J. A. Helsen, Trans. IMF 55 (1977) 113.

    Google Scholar 

  19. C. White and J. Foster, Trans. IMF 56 (1978) 92.

    Google Scholar 

  20. M. J. Bhagwat, J. P. Celis and J. R. Roos, Trans. IMF 61 (1983) 72.

    Google Scholar 

  21. A. Takahashi, Y. Miyoshi and T. Hada, J. Electrochem. Soc. 141 (1994) 954.

    Google Scholar 

  22. D. F. Susan, K. Barmak and A. R. Marder, Thin Solid Films 307 (1997) 133.

    Google Scholar 

  23. C. S. Lin, H. B. Lee and S. H. Hsueh, Metall. Mater. Trans. A 30 (1999) 437.

    Google Scholar 

  24. C. S. Lin, K. C. Peng, P. C. Hsu, L. Chang and C. H. Chen, Mater. Trans. JIM 41 (2000) 777.

    Google Scholar 

  25. C. S. Lin, P. C. Hsu, K. C. Peng, L. Chang and C. H. Chen, Mater. Trans. JIM 42 (2001) 316.

    Google Scholar 

  26. J. Amblard, M. Froment, G. Maurin and N. Spyrellis, J. Microsc. Spectrosc. Electron. 6 (1981) 311.

    Google Scholar 

  27. I. Epelboin, M. Froment and G. Maurin, Plating 56 (1969) 1356.

    Google Scholar 

  28. J. Amblard, I. Epelboin, M. Froment and G. Maurin, J. Appl. Electrochem. 9 (1979) 233.

    Google Scholar 

  29. J. Fransaer, J. P. Celis and J. R. Roos, J. Electrochem. Soc. 139 (1992) 413.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lin, C., Huang, K. Codeposition and Microstructure of Nickel—SiC Composite Coating Electrodeposited from Sulphamate Bath. Journal of Applied Electrochemistry 34, 1013–1019 (2004). https://doi.org/10.1023/B:JACH.0000042676.26158.35

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/B:JACH.0000042676.26158.35

Navigation