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Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

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Abstract

The tensile properties of Sn–8 mass % Zn–3 mass % Bi and Sn–58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn–Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn–Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn–Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn–58Bi and Sn–8Zn–3Bi were also examined.

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Authors and Affiliations

  1. Faculty of Engineering, Gunma University, Kiryu, 376-8515, Japan

    Ikuo Shohji & Tomohiro Yoshida

  2. Akita Prefectural University, Honjo, 015-0055, Japan

    Takehiko Takahashi & Susumu Hioki

Authors
  1. Ikuo Shohji
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  2. Tomohiro Yoshida
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  3. Takehiko Takahashi
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  4. Susumu Hioki
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Shohji, I., Yoshida, T., Takahashi, T. et al. Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder. Journal of Materials Science: Materials in Electronics 15, 219–223 (2004). https://doi.org/10.1023/B:JMSE.0000012458.57604.db

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  • DOI: https://doi.org/10.1023/B:JMSE.0000012458.57604.db

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