Abstract
An experiment is reported on anisotropic etching in a CF4–O2plasma produced by high-voltage gas discharge. The process is applied to SiO2and is also effected on SiC, Si, C (diamond), and As2S3. It is shown that the etch rate is mainly dependent on the oxygen percentage, plasma parameters, and the wafer temperature. It is established that etch rate is maximal at oxygen percentages of 0.8–1.5%, discharge currents of 80–140 mA, and wafer temperatures of 390–440 K. The etching is found to be uniform within 1%.
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REFERENCES
Muller, R.S. and Kamins, T.I., Device Electronics for Integrated Circuits, New York: Wiley, 1986, 2nd ed. Translated under the title Elementy integral'nykh skhem, Moscow: Mir, 1989.
Metody komp'yuternoi optiki (Methods of Computer Optics), Soifer, V.A., Ed., Moscow: Fizmatlit, 2000.
Chernyaev, V.N., Fiziko-khimicheskie protsessy v tekhnologii REA (Physical and Chemical Processes in Electronics Manufacture), Moscow: Vysshaya Shkola, 1987.
Kireev, V.Yu., Danilin, B.S., and Kuznetsov, V.I., Plazmokhimicheskoe i ionno-khimicheskoe travlenie mikrostruktur (Micropatterning by Plasma Etching and Reactive Ion Etching), Moscow: Radio i Svyaz', 1983.
Ivanovskii, G.F., Ionno-plazmennaya obrabotka materialov (Plasma and Ion Surface Engineering), Moscow: Radio i Svyaz', 1986.
Orlikovskii, A.A., Plasma Processes in Micro-and Nanoelectronics, Part 2: New-Generation Plasmochemical Reactors in Microelectronics, Mikroelektronika, 1999, vol. 28,no. 6, pp. 415-426.
Kovalevskii, A.A., Malyshev, V.S., Tsybul'skii, V.V., and Sorokin, V.M., Isotropic Plasma Etching of SiO2 Films, Mikroelektronika, 2002, vol. 31,no. 5, pp. 344-349.
Orlikovskii, A.A., Plasma Processes in Micro-and Nanoelectronics, Part 1: Reactive Ion Etching, Mikroelektronika, 1999, vol. 28,no. 5, pp. 344-362.
Vagner, I.V., Bolgov, E.I., Grakun, V.F., Gokhvel'd, V.L., and Kudlai, V.A., Simple Beam-Forming Arrangement for Generating Arbitrarily Shaped Electron Beams under High-Voltage Gas Discharge, Zh. Tekh. Fiz., 1974, vol. 44, issue 8, pp. 1669-1674.
Kolpakov, A.I. and Kolpakov, V.A., Dragging of Silicon Atoms by Vacancies Created in Molten Aluminum under Ion-Electron Irradiation, Pis'ma Zh. Tekh. Fiz., 1999, vol. 25, issue 15, pp. 58-65.
Komov, A.N., Kolpakov, A.I., Bondareva, N.I., and Zakharenko, V.V., Electron-Beam Soldering Machine for Semiconductor Devices, Prib. Tekh. Eksp., 1984, no. 5, pp. 218-220.
Kolpakov, V.A., Modeling the High-Voltage Gas-Discharge-Plasma Etching of SiO2, Mikroelektronika, 2002, vol. 31,no. 6, pp. 431-440.
Flamm, D.L., Measurements and Mechanisms of Etchant Production During the Plasma Oxidation of CF4 and C2F6, Solid State Technol., 1979, vol. 22,no. 4, pp. 109-116.
Raizer, Yu.P., Fizika gazovogo razryada (Gas-Discharge Physics), Moscow: Nauka, 1987.
Kireev, V.Yu., Nazarov, D.A., and Kuznetsov, V.I., Ion-Enhanced Dry Etching, Elektron. Obrab. Mater., 1986, no. 67, pp. 40-43.
Gerlach-Meyer, V., Ion Enhanced Gas-Surface Reactions: A Kinetic Model for the Etching Mechanism, Surf. Sci., 1981, vol. 103,no. 213, pp. 524-534.
Harsberger, W.R. and Porter, R.A., Spectroscopic Analysis of RF Plasmas, Solid State Technol., 1979, vol. 22,no. 4, pp. 90-103.
Horiike, Y., Dry Etching: An Overview, Jpn. Annu. Rev. Electron. Comput. Telecommun. Semicond. Technol., 1983, vol. 8, pp. 55-72.
Kolpakov, A.I. and Rastegaev, V.P., Raschet elektricheskogo polya gazorazryadnoi pushki vysokovol'tnogo tipa (Electric-Field Analysis of a High-Voltage Gas-Discharge Gun), Available from VINITI, 1979, no. 1381-79 Dep.
Poulsen, R.G. and Brochu, M., Importance of Temperature and Temperature Control in Plasma Etching, Si Bricond Silicon, 1973, no. 1973.
Moreau, W.M., Semiconductor Lithography: Principles, Practices, and Materials, New York: Plenum, 1988. Translated under the title Mikrolitografiya. Printsipy, metody, materialy, Moscow: Mir, 1990.
Mirkin, L.I., Spravochnik po rentgenostrukturnomu analizu polikristallov (Handbook of X-ray Crystallography for Polycrystalline Materials), Prof. Umanskii, Ya.S., Ed., Moscow: Gosudarstvennoe Izdatel'stvo Fiziko-Matematicheskoi Literatury, 1961.
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Kazanskii, N.L., Kolpakov, V.A. & Kolpakov, A.I. Anisotropic Etching of SiO2 in High-Voltage Gas-Discharge Plasmas. Russian Microelectronics 33, 169–182 (2004). https://doi.org/10.1023/B:RUMI.0000026175.29416.eb
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DOI: https://doi.org/10.1023/B:RUMI.0000026175.29416.eb