Issue 83, 2014
From the journal:

RSC Advances

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

Jun Hou,a   Guohua Li,a   Na Yang,a   Lili Qin,a   Maryam E. Grami,*b   Qingxin Zhang,a   Nongyue Wanga  and  Xiongwei Qu*a  

* Corresponding authors

a Institute of Polymer Science and Engineering, School of Chemical Engineering, Hebei University of Technology, Tianjin, People's Republic of China
E-mail: xwqu@hebut.edu.cn

b Composite Materials Engineering, Winona State University, Winona, USA
E-mail: MGrami@winona.edu

Abstract

Hexagonal boron nitride (h-BN) microparticles, modified by surface coupling agent 3-aminopropyl triethoxy silane (APTES), were used to fabricate thermally conductive epoxy/BN composites, and the effects of modified-BN content on the thermal and insulating properties were investigated. It was found that incorporation of h-BN particles in the epoxy matrix significantly enhanced the thermal conductivity of the composites. With 30 wt% modified-BN loading, the thermal conductivity of the composites was 1.178 W m−1 K−1, 6.14 times higher than that of the neat epoxy. Fabricated epoxy/BN composites exhibited improved thermal stability, storage modulus, and glass transition temperature with increased BN content. The composites also possessed excellent electrical insulation properties. These results revealed that epoxy/BN composites are promising as efficient heat-releasing materials for thermal management and microelectronic encapsulation.

Graphical abstract: Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

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Article information

DOI
https://doi.org/10.1039/C4RA07394K
Article type
Paper
Submitted
21 Jul 2014
Accepted
10 Sep 2014
First published
10 Sep 2014

RSC Adv., 2014,4, 44282-44290

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Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

J. Hou, G. Li, N. Yang, L. Qin, M. E. Grami, Q. Zhang, N. Wang and X. Qu, RSC Adv., 2014, 4, 44282 DOI: 10.1039/C4RA07394K

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