Abstract
We have developed a new robust method for rolling lithographically defined planar strained heterofilms in preset directions to obtain three-dimensional (3D) free-standing shells of complex geometry. With the example of InGaAs/GaAs strained heterofilms, we show the possibility of forming 3D shells that may be used for creating various microelectromechanical systems. The method features natural compatibility with the well-developed integration technology, which allows formation of micro- (nano-) mechanical and electronic device components on one and the same chip. The simplicity of the proposed method and its applicability to a broad range of heterostructures give us all grounds to anticipate its great potential in device application.
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