Abstract
The construction of micromechanic devices is developing from the second to the third dimension. Therefore, a technique is needed that enables bonding between more than two substrates. The author presents two technologies for the anodic bonding of Pyrex-type glass and silicon with more than two substrates. A three-substrate micromachined passive valve, which was assembled by anodic bonding is presented. Theoretical models are shown and technological problems discussed.
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