Kinetic roughening of GaAs(001) during thermal Cl2 etching

J. H. Schmid, A. Ballestad, B. J. Ruck, M. Adamcyk, and T. Tiedje
Phys. Rev. B 65, 155315 – Published 29 March 2002
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Abstract

The surface morphology of Cl2-etched GaAs(001) is measured as a function of etch time by atomic force microscopy and elastic light scattering. A flat surface is found to become rougher during the etch whereas a textured substrate becomes smoother. We have numerically simulated this behavior. It is found that the evolution of surface roughness at length scales between 50 nm and 5μm can be described with excellent accuracy by a continuum equation for the surface height h(x,t), which is given by dh/dt=ν2hλ/2(h)2K4h+η, where η is a random noise input.

  • Received 29 September 2001

DOI:https://doi.org/10.1103/PhysRevB.65.155315

©2002 American Physical Society

Authors & Affiliations

J. H. Schmid, A. Ballestad, B. J. Ruck*, M. Adamcyk, and T. Tiedje

  • Department of Physics and Astronomy, University of British Columbia, Vancouver, British Columbia, V6T 1Z1 Canada

  • *Present address: School of Chemical and Physical Sciences, Victoria University of Wellington, Box 600, Wellington, New Zealand.
  • Also, at Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, British Columbia, V6T 1Z4 Canada.

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Vol. 65, Iss. 15 — 15 April 2002

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