J. Liu¹, F. Li², Y. Zeng³, Z. Jiang^4,5, L. Liu⁶, D. Wang^4,*, Z.-G. Ye^7,2, and C.-L. Jia^4,8

• ¹State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an 710049 China
• ²Electronic Materials Research Laboratory-Key Laboratory of the Ministry of Education, International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China
• ³School of Materials Science and Engineering, State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, No. 1, Qinghua Yuan, Beijing 100084, China
• ⁴School of Microelectronics and State Key Laboratory for Mechanical Behaviour of Materials, Xi'an Jiaotong University, Xi'an 710049, China
• ⁵Department of Physics and Institute for Nanoscience and Engineering, University of Arkansas, Fayetteville, Arkansas 72701, USA
• ⁶College of Materials Science and Engineering, Guilin Univeristy of Techonology, Guilin 541004, China
• ⁷Department of Chemistry and 4D LABS, Simon Fraser University, Burnaby, British Columbia, V5A 1A6, Canada
• ⁸Peter Grünberg Institute, Ernst Ruska Center for Microscopy and Spectroscopy with Electrons, Research Center Jülich, D-52425 Jülich, Germany

• ^*dawei.wang@mail.xjtu.edu.cn