Thermal expansion behavior of ultrathin polymer films supported on silicon substrate

Tsukasa Miyazaki, Koji Nishida, and Toshiji Kanaya
Phys. Rev. E 69, 061803 – Published 22 June 2004

Abstract

The thermal expansion behavior of polystyrene (PS) thin films was investigated using x-ray reflectivity, focusing on ultrathin films below 10nm. It was found that the glass transition temperature Tg decreases with thickness as reported by many researchers while it is almost independent of thickness and constant at 354K for films below 10nm. The thickness dependence of Tg was well reproduced by a two-layer model consisting of a mobile surface layer with Tg of 354.5K and a bulklike layer with Tg of 373K(=bulkTg), suggesting that the so-called immobile dead layer near the substrate is negligible or very thin in this system. This surface Tg of 354K was confirmed by the relaxation of surface roughness of as-deposited films at about 354K. It was also found that the thermal expansivity decreases with thickness in the glassy state as well as in the molten state while the reduction is smaller in the molten state.

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  • Received 16 November 2003

DOI:https://doi.org/10.1103/PhysRevE.69.061803

©2004 American Physical Society

Authors & Affiliations

Tsukasa Miyazaki1,2,*, Koji Nishida1, and Toshiji Kanaya1,†

  • 1Institute for Chemical Research, Kyoto University, Uji, Kyoto 611-0011, Japan
  • 2Nitto Denko Corporation, 1-1-2, Shimohozumi, Ibaraki, Osaka 567-8680, Japan

  • *Corresponding author. Electronic address: tsukasa_miyazaki@gg.nitto.co.jp
  • Corresponding author. Electronic address:kanaya@scl.kyoto-u.ac.jp

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Issue

Vol. 69, Iss. 6 — June 2004

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