Reducing the surface roughness beyond the pulsed-laser-deposition limit

E. Vasco, C. Polop, and J. L. Sacedón
Phys. Rev. E 80, 041604 – Published 23 October 2009

Abstract

Here, we outline the theoretical fundamentals of a promising growth kinetics of films from the vapor phase, in which pulsed fluxes are combined with temperature transients to enable short-range surface relaxations (e.g., species rearrangements) and to inhibit long-range relaxations (atomic exchange between species). A group of physical techniques (fully pulsed thermal and/or laser depositions) based on this kinetics is developed that can be used to prepare films with roughnesses even lower than those obtained with pulsed-laser deposition, which is the physical vapor-phase deposition technique that has produced the flattest films reported so far.

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  • Received 22 April 2009

DOI:https://doi.org/10.1103/PhysRevE.80.041604

©2009 American Physical Society

Authors & Affiliations

E. Vasco1, C. Polop2, and J. L. Sacedón1

  • 1Instituto de Ciencia de Materiales de Madrid, Consejo Superior de Investigaciones Científicas, 28049 Madrid, Spain
  • 2Depto. Física de la Materia Condensada, Universidad Autónoma de Madrid, 28049 Madrid, Spain

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Issue

Vol. 80, Iss. 4 — October 2009

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