Structures and Potential Superconductivity in SiH4 at High Pressure: En Route to “Metallic Hydrogen”

Ji Feng, Wojciech Grochala, Tomasz Jaroń, Roald Hoffmann, Aitor Bergara, and N. W. Ashcroft
Phys. Rev. Lett. 96, 017006 – Published 11 January 2006; Erratum Phys. Rev. Lett. 97, 119901 (2006)
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Abstract

A way to circumvent the high pressures needed to metallize hydrogen is to “precompress” it in hydrogen-rich molecules, a strategy probed theoretically for silane. We show that phases with tetrahedral SiH4 molecules should undergo phase transitions with sixfold- and eightfold-coordinate Si appearing above 25 GPa. The most stable structure found can be metallized at under a megabar and at a compression close to the prediction of Goldhammer-Herzfeld criterion. According to a BCS-like estimate, metallic silane should be a high-temperature superconductor.

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  • Received 20 August 2005

DOI:https://doi.org/10.1103/PhysRevLett.96.017006

©2006 American Physical Society

Erratum

Erratum: Structures and Potential Superconductivity in SiH4 at High Pressure: En Route to “Metallic Hydrogen” [Phys. Rev. Lett. 96, 017006 (2006)]

Ji Feng, Wojciech Grochala, Tomasz Jaroń, Roald Hoffmann, Aitor Bergara, and N. W. Ashcroft
Phys. Rev. Lett. 97, 119901 (2006)

Authors & Affiliations

Ji Feng1, Wojciech Grochala1,2,*, Tomasz Jaroń3, Roald Hoffmann1,2,†, Aitor Bergara4,‡, and N. W. Ashcroft2,5,§

  • 1Department of Chemistry and Chemical Biology, Cornell University, Ithaca, New York 14853, USA
  • 2Cornell Center for Materials Research, Cornell University, Ithaca, New York 14853, USA
  • 3Department of Chemistry, University of Warsaw, Pasteur 1, Warsaw 02093, Poland
  • 4Materia Kondentsatuaren Fisika Saila, and DIPC, Euskal Herriko Unibertsitatea, 644 Posta Kutxatila, 48080 Bilbo, Basque Country, Spain
  • 5Laboratory of Atomic and Solid State Physics and Department of Physics, Cornell University, Ithaca, New York 14853, USA

  • *Electronic address: wg22@cornell.edu
  • Corresponding author. Electronic address: rh34@cornell.edu
  • Electronic address: wmpvejaa@lg.ehu.es
  • §Electronic address: nwa@ccmr.cornell.edu

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Issue

Vol. 96, Iss. 1 — 13 January 2006

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