Fingerprint of the inverse Rashba-Edelstein effect at heavy-metal/Cu interfaces

Rui Yu, Bingfeng Miao, Qi Liu, Kang He, Weishan Xue, Liang Sun, Mingzhong Wu, Yizheng Wu, Zhe Yuan, and Haifeng Ding
Phys. Rev. B 102, 144415 – Published 12 October 2020
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Abstract

We report the direct observation of the fingerprint of the inverse Rashba-Edelstein effect (IREE) via investigations of the spin-to-charge conversion in Ta(Pt)/Cu and Cu/Ta(Pt) as a function of the heavy-metal thickness. The converted charge voltages have opposite signs for samples with reversed stacking orders in the ultrathin regime and have the same sign at higher thickness. The effect is demonstrated with two independent experimental approaches and supported by first-principles calculations. Our observations unambiguously demonstrate the existence of the IREE at heavy-metal/Cu interfaces and provide a framework for manipulating the spin-charge conversion via interface engineering.

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  • Received 10 March 2020
  • Revised 16 September 2020
  • Accepted 17 September 2020

DOI:https://doi.org/10.1103/PhysRevB.102.144415

©2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Rui Yu1,*, Bingfeng Miao1,2,*, Qi Liu1, Kang He1, Weishan Xue3, Liang Sun1,2, Mingzhong Wu4, Yizheng Wu2,5, Zhe Yuan3,†, and Haifeng Ding1,2,‡

  • 1National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing, People's Republic of China
  • 2Collaborative Innovation Center of Advanced Microstructures, Nanjing, People's Republic of China
  • 3Center for Advanced Quantum Studies and Department of Physics, Beijing Normal University, Beijing 100875, People's Republic of China
  • 4Department of Physics, Colorado State University, Fort Collins, Colorado 80523, USA
  • 5Department of Physics, Fudan University, 220 Handan Road, Shanghai 200433, People's Republic of China

  • *These authors contributed equally to this work.
  • zyuan@bnu.edu.cn
  • hfding@nju.edu.cn

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Issue

Vol. 102, Iss. 14 — 1 October 2020

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