Steadily Decreasing Power Loss of a Double Schottky Barrier Originating from the Dynamics of Mobile Ions with Stable Interface States

Zhuolin Cheng, Zongke Hou, Yao Wang, Men Guo, Kangning Wu, Jianying Li, and Ying Lin
Phys. Rev. Applied 17, 034042 – Published 15 March 2022
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Abstract

A general aging model of the double Schottky barrier was proposed to unveil the long-term aging behaviors of ZnO varistor ceramics, especially for those ones with steadily decreasing power loss. For those samples, the barrier height and electrical properties were even enhanced rather than commonly deteriorated, which were beyond the classic ion migration model. In this paper, inspired by the unique reversible aging of them, interface states are proposed to remain stable in those samples. The major mobile ions, which have been in debate, are further identified to be Zni ions. Based on these assumptions, a quantitative dynamic ion migration-diffusion model is proposed. The calculated power loss steadily decreases with aging time, which well supported our proposal. When the interface states are not combined with those mobile ions, the formation of a “U-shape” ion spatial distribution in depletion layers is found to be responsible for the unique aging phenomena, i.e., a reduction in the depletion layer and interfacial charge, a rise in the depletion layer width, and an increase in the barrier height. However, continuously increasing power loss would be generated if the mobile ions combined with the interface states. Therefore, a general mechanism on the aging of the double Schottky barrier is unveiled that it is a competition process between consumption of the interface states and the dynamics of mobile ions in depletion layers.

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  • Received 2 October 2021
  • Revised 9 February 2022
  • Accepted 16 February 2022

DOI:https://doi.org/10.1103/PhysRevApplied.17.034042

© 2022 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Zhuolin Cheng1,‡, Zongke Hou1,‡, Yao Wang1, Men Guo1, Kangning Wu1,*, Jianying Li1,†, and Ying Lin2

  • 1State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049, China
  • 2School of Electrical and Automation Engineering, Hefei University of Technology, Hefei 230009, China

  • *wukning@xjtu.edu.cn
  • lijy@xjtu.edu.cn
  • These authors contributed equally to this work.

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Issue

Vol. 17, Iss. 3 — March 2022

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