Quantum-corrected thickness-dependent thermal conductivity in amorphous silicon predicted by machine learning molecular dynamics simulations

Yanzhou Wang, Zheyong Fan, Ping Qian, Miguel A. Caro, and Tapio Ala-Nissila
Phys. Rev. B 107, 054303 – Published 6 February 2023
PDFHTMLExport Citation

Abstract

Amorphous silicon (a-Si) is an important thermal-management material and also serves as an ideal playground for studying heat transport in strongly disordered materials. Theoretical prediction of the thermal conductivity of a-Si in a wide range of temperatures and sample sizes is still a challenge. Herein we present a systematic investigation of the thermal transport properties of a-Si by employing large-scale molecular dynamics (MD) simulations with an accurate and efficient machine learned neuroevolution potential (NEP) trained against abundant reference data calculated at the quantum-mechanical density-functional-theory level. The high efficiency of NEP allows us to study the effects of finite size and quenching rate in the formation of a-Si in great detail. We find that a simulation cell up to 64000 atoms (a cubic cell with a linear size of 11 nm) and a quenching rate down to 1011s1 are required for almost convergent thermal conductivity. Structural properties, including short- and medium-range order as characterized by the pair-correlation function, angular-distribution function, coordination number, ring statistics, and structure factor are studied to demonstrate the accuracy of NEP and to further evaluate the role of quenching rate. Using both the heterogeneous and homogeneous nonequilibrium MD methods and the related spectral decomposition techniques, we calculate the temperature- and thickness-dependent thermal conductivity values of a-Si and show that they agree well with available experimental results from 10 K to room temperature. Our results also highlight the importance of quantum effects in the calculated thermal conductivity and support the quantum-correction method based on the spectral thermal conductivity.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
3 More
  • Received 20 June 2022
  • Revised 14 November 2022
  • Accepted 11 January 2023

DOI:https://doi.org/10.1103/PhysRevB.107.054303

©2023 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Yanzhou Wang1,2, Zheyong Fan2,3,*, Ping Qian1,†, Miguel A. Caro4,5, and Tapio Ala-Nissila2,6,‡

  • 1Beijing Advanced Innovation Center for Materials Genome Engineering, Department of Physics, University of Science and Technology Beijing, Beijing 100083, China
  • 2Department of Applied Physics, QTF Center of Excellence, Aalto University, FIN-00076 Aalto, Espoo, Finland
  • 3College of Physical Science and Technology, Bohai University, Jinzhou, 121013, China
  • 4Department of Electrical Engineering and Automation, Aalto University, FIN-02150 Espoo, Finland
  • 5Department of Chemistry and Materials Science, Aalto University, FIN-02150 Espoo, Finland
  • 6Interdisciplinary Centre for Mathematical Modelling and Department of Mathematical Sciences, Loughborough University, Loughborough, Leicestershire LE11 3TU, United Kingdom

  • *brucenju@gmail.com
  • qianping@ustb.edu.cn
  • tapio.ala-nissila@aalto.fi

Article Text (Subscription Required)

Click to Expand

Supplemental Material (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 107, Iss. 5 — 1 February 2023

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×