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Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana (Alcatel, Plano, Texas, USA)
Rob Horsley (Celestica, Kidsgrove, Staffordshire, UK)
John Lau (Agilent Technologies Inc., Santa Clara, California, USA)
Ken Snowdon (Nortel Networks)
Dongkai Shangguan (Flextronics, San Jose, California, USA)
Jerry Gleason (Hewlett Packard Co.)
Irv Memis (IBM, Endicott, New York, USA)
Dave Love (Sun Microsystems, Menlo Park, California, USA)
Walter Dauksher (Agilent, Fort Collins, Colorado, USA)
Bob Sullivan (HDPUG, Scottsdale, Arizona, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2004

704

Abstract

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.

Keywords

Citation

Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, J., Memis, I., Love, D., Dauksher, W. and Sullivan, B. (2004), "Design, materials and process for lead‐free assembly of high‐density packages", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 53-62. https://doi.org/10.1108/09540910410517068

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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