Future Trends of Electronics in Asia
Abstract
This paper discusses the future trends of electronic interconnections to produce electronic equipment being manufactured in the Far East. Reviewed are details of simplistic circuits, as well as relatively complex multilayer boards used in new computer technology. The size of the market, techniques for component assembly, and various other aspects of the approach to electronic packaging are discussed.
Citation
Nakahara, H. (1985), "Future Trends of Electronics in Asia", Circuit World, Vol. 11 No. 3, pp. 32-34. https://doi.org/10.1108/eb046001
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited