Simulation of water/FMWCNT nanofluid forced convection in a microchannel filled with porous material under slip velocity and temperature jump boundary conditions
International Journal of Numerical Methods for Heat & Fluid Flow
ISSN: 0961-5539
Article publication date: 17 June 2019
Issue publication date: 30 April 2020
Abstract
Purpose
This study aims to numerically study the forced convection effects on a two-dimensional microchannel filled with a porous material containing the water/FMWCNT nanofluid. The upper and lower microchannel walls were fully insulated thermally along 15 per cent of their lengths at each end of the microchannel, with the in-between length being exposed to a constant temperature. The slip velocity boundary condition was applied along the microchannel walls.
Design/methodology/approach
The Navier–Stokes equations were discretized before being solved numerically via a FORTRAN computer code. The following ranges were considered for the studied parameters: slip factor (B) equal to 0.001, 0.01 and 0.1; Reynolds number (Re) between 10 and 100; solid nanoparticle mass fraction (ϕ) between 0.0012 and 0.0025; Darcy number (Da) between 0.001 and 0.1; and porosity factor (ε) between 0.4 and 0.9.
Findings
Increasing the Da caused a greater increase in the velocity profile than increasing Re, whereas increasing porosity did not affect the velocity profile growth at all.
Originality/value
This paper is the continuation of the authors’ previous studies. Using the water/FMWCNT nanofluid as the working fluid in microchannels is among the achievements of this study.
Keywords
Citation
Gholamalizadeh, E., Pahlevanzadeh, F., Ghani, K., Karimipour, A., Nguyen, T.K. and Safaei, M.R. (2020), "Simulation of water/FMWCNT nanofluid forced convection in a microchannel filled with porous material under slip velocity and temperature jump boundary conditions", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 30 No. 5, pp. 2329-2349. https://doi.org/10.1108/HFF-01-2019-0030
Publisher
:Emerald Publishing Limited
Copyright © 2019, Emerald Publishing Limited