Analysis and improvement on cracking failure of glass sealed surface mount diodes

Xue Jia; Yang Qu

doi:10.1117/12.2674177

9 March 2023 Analysis and improvement on cracking failure of glass sealed surface mount diodes

Xue Jia, Yang Qu

Proceedings Volume 12600, International Conference on Optoelectronic Materials and Devices (ICOMD 2022); 126001L (2023) https://doi.org/10.1117/12.2674177
Event: 2022 International Conference on Optoelectronic Materials and Devices, 2022, Chongqing, China

Abstract

With development of electronic equipment to miniaturization and lightweight, the demand for miniaturization chip devices is increasing. Because glass encapsulation devices are prone to damage, circuit faults often occur. In this paper, according to the typical failure phenomenon caused by the cracking of glass packaging surface diode, the cracking failure reason analysis and relevant test verification are carried out, which provides useful basis for further improving the reliability of glass packaging surface diode.

Citation Download Citation

Xue Jia and Yang Qu "Analysis and improvement on cracking failure of glass sealed surface mount diodes", Proc. SPIE 12600, International Conference on Optoelectronic Materials and Devices (ICOMD 2022), 126001L (9 March 2023); https://doi.org/10.1117/12.2674177

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