Paper
19 August 1999 Fabrication and characterization of three-dimensional microfluidic arrays
Sheldon M. Kugelmass, Chao Lin, Sheila H. DeWitt
Author Affiliations +
Proceedings Volume 3877, Microfluidic Devices and Systems II; (1999) https://doi.org/10.1117/12.359325
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
3D microfluidic arrays, containing a network of channels and vias, have been fabricated in Pyrex, and silicon, using a range of techniques including chemical etching, deep reactive ion etching, laser micromachining and anodic bonding. Fluid is distributed along the layers of the structure through this series of lateral channels and passes from layer to layer through via holes. Vias on the order of 50 micrometers in diameter act as valves or `capillary breaks'; in which surface tension forces prevent the continued flow of fluid. An increase in the pressure head in the line causes the capillary break to yield, switching the valve, and allowing fluid to flow to the next layer. Circuit network models were applied to determine device parameters to balance pressure losses and allow uniform distribution to 12 branches from a single feed line more than 30 mm in length. These arrays have been employed in a 10 X 10 array of microchannels and microreactors to synthesize a library of 100 unique organic compounds in a 4-step solid phase synthesis protocol. All of the products generated had product purities < 70% (HPLC Area%).
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sheldon M. Kugelmass, Chao Lin, and Sheila H. DeWitt "Fabrication and characterization of three-dimensional microfluidic arrays", Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); https://doi.org/10.1117/12.359325
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Cited by 5 scholarly publications.
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KEYWORDS
Microfluidics

Capillaries

Silicon

Deep reactive ion etching

Wet etching

Analog electronics

Etching

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