High-resolution noncontact thermal characterization of semiconductor devices

James Christofferson; Daryoosh Vashaee; Ali Shakouri; Philip Melese

doi:10.1117/12.429354

5 June 2001 High-resolution noncontact thermal characterization of semiconductor devices

James Christofferson, Daryoosh Vashaee, Ali Shakouri, Philip Melese

Proceedings Volume 4275, Metrology-based Control for Micro-Manufacturing; (2001) https://doi.org/10.1117/12.429354
Event: Photonics West 2001 - LASE, 2001, San Jose, CA, United States

Abstract

Non-contact optical methods can be used for sub micron surface thermal characterization of active semiconductor devices. Point measurements were first made, and then real time thermal images were acquired with a specialized PIN- array detector. This method of thermal imaging can have spatial resolution better than the diffraction limit of an infrared camera and can work in a wide range of ambient temperatures. The experimentally obtained thermal resolution is on the order of 50 mK.

Citation Download Citation

James Christofferson, Daryoosh Vashaee, Ali Shakouri, and Philip Melese "High-resolution noncontact thermal characterization of semiconductor devices", Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); https://doi.org/10.1117/12.429354

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