Paper
5 September 2001 Enhanced dispositioning of reticle defects using the Virtual Stepper with automated defect severity scoring
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Abstract
As Optical Proximity Correction (OPC0 and Phase Shifting (PSM) become more and more commonly used for producing smaller features on wafer, the photomask (reticle) manufacturing, that is mask writing, inspection and repairing, and quality assurance become more challenging for both mask shops and wafer fabs. Consequently, a powerful defect analysis tool is needed to determine which defect is a nuisance defect, which defect needs to be repaired, and how good is the repair. It should have the capability for defect printability prediction and analysis of defect impact on device performance. In this paper, we will study and characterize the printability prediction of programmed defects on binary OPC masks by the Virtual Stepper System with its newly developed Automated Defect Severity Scoring (ADSS) function. AMD's defect test reticles HellOPC2 were used. The Virtual Stepper simulation and defect impact analysis results (the automatically calculated Defect Severity Score) will be compared to the SEM images and measurements of wafer prints using 193nm lithography. The results demonstrate that the Virtual Stepper System with its ADSS feature can provide its user with an automate, fast and accurate way of analyzing the impact of a defect. The Virtual Stepper System with ADSS function will be a suitable tool for photomask defect critically assessment in mask shops and wafer fabs.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lynn Cai, Khoi A. Phan, Chris A. Spence, Linyong Pang, and Kevin K. Chan "Enhanced dispositioning of reticle defects using the Virtual Stepper with automated defect severity scoring", Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); https://doi.org/10.1117/12.438388
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CITATIONS
Cited by 2 scholarly publications and 39 patents.
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KEYWORDS
Semiconducting wafers

Photomasks

Reticles

Decision support systems

Scanning electron microscopy

Virtual reality

Critical dimension metrology

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