Paper
17 October 2003 Process spread reduction of laser microspot welding of thin copper parts using real-time control
Antoon Blom, Par Dunias, Piet van Engen, Willem Hoving, Janneke de Kramer
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Abstract
In present-day industry, particularly in the area of microelectronics packaging and assembly, there is a strong demand for highly reliable, miniature joints of thin copper parts. Laser welding could be the perfect solution for making such joints if this process were not highly sensitive to various parameters, such as the reflectivity of the copper workpiece, the gap between the product parts to be welded, and laser-power density. The robustness of the process is further limited because two important product properties (reflectivity and heat conductivity) change strongly during welding. An investigation has been performed to increase the robustness by means of real-time feedback control, based on several parameters that are monitored simultaneously during the process. It is shown how this drastically decreases the influence of the above-mentioned variations with "heat conduction" welds. The control algorithm was based on an approximate model of the (non-linear) welding process. In addition, it is shown how adaptive feedforward control is required to cope with the limited response time of the system. Finally, some remarks are made on experiences iterative learning control. This investigation was part of the European co-operation project SLAPS, performed within the framework of the IMS/Brite-Euram III program. The support from the European Commission and the IMS regional offices is gratefully acknowledged.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Antoon Blom, Par Dunias, Piet van Engen, Willem Hoving, and Janneke de Kramer "Process spread reduction of laser microspot welding of thin copper parts using real-time control", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.478612
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Cited by 32 scholarly publications and 1 patent.
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KEYWORDS
Copper

Laser welding

Microelectronics

Process control

Reflectivity

Laser processing

Packaging

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