Paper
6 December 2004 Aerial-image-based inspection on subresolution scattering bars
Author Affiliations +
Abstract
The paper presents the results of a study to define a production-worthy inspection technique for subresolution solid and hollow scattering features used in 193-nm lithography. Masks are inspected using conventional high-NA and aerial-imaging-based mask inspection tools. Inspection results are compared regarding capture rate and nuisance defect rate.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Luke T.H. Hsu, C. C. Lin, Anja Rosenbusch, Yuval Bloomberg, and Simon Kurin "Aerial-image-based inspection on subresolution scattering bars", Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); https://doi.org/10.1117/12.579749
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Inspection

Photomasks

Scattering

Semiconducting wafers

Solids

Resolution enhancement technologies

Defect detection

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