The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards

Leontios Stampoulidis; Konstantinos Vyrsokinos; Christos Stamatiadis; Hercules Avramopoulos; Lars Zimmermann; Karsten Voigt; Zhen Sheng; Dries Van Thourhout; Jochen Kreissl; Ludwig Mörl; Jens Bolten; Thorsten Wahlbrink; Fausto Gomez-Agis; Eduward Tangdiongga; Harmen J. S. Dorren; Annachiara Pagano; Emilio Riccardi

doi:10.1117/12.855958

17 May 2010 The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards

Leontios Stampoulidis, Konstantinos Vyrsokinos, Christos Stamatiadis, Hercules Avramopoulos, Lars Zimmermann, Karsten Voigt, Zhen Sheng, Dries Van Thourhout, Jochen Kreissl, Ludwig Mörl, Jens Bolten, Thorsten Wahlbrink, Fausto Gomez-Agis, Eduward Tangdiongga, Harmen J. S. Dorren, Annachiara Pagano, Emilio Riccardi

Author Affiliations +

Proceedings Volume 7719, Silicon Photonics and Photonic Integrated Circuits II; 771909 (2010) https://doi.org/10.1117/12.855958
Event: SPIE Photonics Europe, 2010, Brussels, Belgium

Abstract

The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOMgeneration of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.

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Leontios Stampoulidis, Konstantinos Vyrsokinos, Christos Stamatiadis, Hercules Avramopoulos, Lars Zimmermann, Karsten Voigt, Zhen Sheng, Dries Van Thourhout, Jochen Kreissl, Ludwig Mörl, Jens Bolten, Thorsten Wahlbrink, Fausto Gomez-Agis, Eduward Tangdiongga, Harmen J. S. Dorren, Annachiara Pagano, and Emilio Riccardi "The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards", Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 771909 (17 May 2010); https://doi.org/10.1117/12.855958

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