Paper
15 October 2012 Silicon nanowire arrays using g-line photolithography
Author Affiliations +
Proceedings Volume 8549, 16th International Workshop on Physics of Semiconductor Devices; 85492E (2012) https://doi.org/10.1117/12.927422
Event: 16th International Workshop on Physics of Semiconductor Devices, 2011, Kanpur, India
Abstract
One and two micron wide silicon fin patterns realized using standard g-line UV lithography are oxidized to accomplish nanowires. Simulation results envisage the possibility of silicon nanowire fabrication using top down fabrication approach. Experimental results show the feasibility of the process. SEM imaging was used to characterize the nanowires. Silicon nanowires up to 150 nm are demonstrated by the mentioned top down approach. Silicon consumption from three sides of the fins reduces their cross-sectional geometries. Stress developed during the oxidation of silicon leads to pinch-off in the fins, with aspect ratios <3. This pinch-off divides the fin patterns into two parts vertically; upper part detaches from the lower one and converges into silicon Nanowire, buried in silicon oxide. Simulation and process results for different process temperatures, time and fin aspect ratios are presented in the paper.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rahul Prajesh, Hemant Tholia, and Ajay Agarwal "Silicon nanowire arrays using g-line photolithography", Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 85492E (15 October 2012); https://doi.org/10.1117/12.927422
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KEYWORDS
Silicon

Oxidation

Nanowires

Oxides

Critical dimension metrology

Optical lithography

Etching

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