Direct Mask Overlay Inspection

Liang-Choo Hsia; Lo-Soun Su

doi:10.1117/12.935140

7 November 1983 Direct Mask Overlay Inspection

Liang-Choo Hsia, Lo-Soun Su

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935140
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

In this paper, we present a mask inspection methodology and procedure that involves direct X-Y measurements. A group of dice is selected for overlay measurement; four measurement targets were laid out in the kerf of each die. The measured coordinates are then fit-ted to either a "historical" grid, which reflects the individual tool bias, or to an ideal grid squares fashion. Measurements are done using a Nikon X-Y laser interferometric measurement system, which provides a reference grid. The stability of the measurement system is essential. We then apply appropriate statistics to the residual after the fit to determine the overlay performance. Statistical methods play an important role in the product disposition. The acceptance criterion is, however, a compromise between the cost for mask making and the final device yield. In order to satisfy the demand on mask houses for quality of masks and high volume, mixing lithographic tools in mask making has become more popular, in particular, mixing optical and E-beam tools. In this paper, we also discuss the inspection procedure for mixing different lithographic tools.

Citation Download Citation

Liang-Choo Hsia and Lo-Soun Su "Direct Mask Overlay Inspection", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935140

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