Formation of Highly Uniform Micrometer-Order-Thick Polycrystalline Silicon Films by Flash Lamp Annealing of Amorphous Silicon on Glass Substrates

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Published 6 December 2007 Copyright (c) 2007 The Japan Society of Applied Physics
, , Citation Keisuke Ohdaira et al 2007 Jpn. J. Appl. Phys. 46 7603 DOI 10.1143/JJAP.46.7603

1347-4065/46/12R/7603

Abstract

Polycrystalline silicon (poly-Si) films as thick as 4.5 µm are prepared by flash lamp annealing (FLA) of amorphous silicon (a-Si) films without thermal damage onto glass substrates. The a-Si films are deposited by catalytic chemical vapor deposition (Cat-CVD) at 320 °C. Since the hydrogen content in Cat-CVD a-Si films is as low as 3 at. %, they are easily converted to poly-Si without any dehydrogenation treatment. Chromium (Cr) films 60 nm thick are coated onto glass substrates to achieve high area uniformity of poly-Si formation. Secondary ion mass spectroscopy (SIMS) reveals that no diffused Cr atoms are detected inside poly-Si films and that crystallization is not the well-known metal-induced crystallization. Raman spectra from the poly-Si films show high crystallinity close to 1, and the photoluminescence (PL) spectrum demonstrates clear band-to-band transition, indicating the formation of device-quality poly-Si by FLA of Cat-CVD a-Si.

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