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Analysis of thermal behaviors of spin-torque-transfer RAM: a simulation study

Published:18 August 2010Publication History

ABSTRACT

We present an accurate model of the self-heating effect in the Spin-Torque-Transfer RAM (STTRAM) using finite-volume-methods and thermal RC based compact models. We couple device level thermal simulation to the self-heating phenomenon to show that self-heating during write operation can result in significant temperature increase in STTRAM which in turn adversely affect the read disturb, leakage energy and sensing accuracy.

References

  1. T. Kawahara et al, "2 Mb SPRAM (Spin-Transfer Torque RAM) With Bit-by-Bit Bi-Directional Current Write and Parallelizing-Direction Current Read", IEEE JSSC, Jan. 2008.Google ScholarGoogle Scholar
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  7. S.Chatterjee et al, "A Methodology for Robust, Energy Efficient Design of Spin-Torque-Transfer RAM Arrays at Scaled Technologies", ICCAD 2009. Google ScholarGoogle ScholarDigital LibraryDigital Library
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  1. Analysis of thermal behaviors of spin-torque-transfer RAM: a simulation study

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    • Published in

      cover image ACM Conferences
      ISLPED '10: Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
      August 2010
      458 pages
      ISBN:9781450301466
      DOI:10.1145/1840845

      Copyright © 2010 ACM

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      Association for Computing Machinery

      New York, NY, United States

      Publication History

      • Published: 18 August 2010

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