Shreepad A. Panth
ABSTRACT
In a gate-level monolithic 3D IC (M3D), all the transistors in a single logic gate occupy the same tier, and gates in different tiers are connected using nano-scale monolithic inter-tier vias. This design style has the benefit of the superior power-performance quality offered by flat implementations (unlike block-level M3D), and zero total silicon area overhead compared to 2D (unlike transistor-level M3D). In this paper we develop, for the first time, a complete RTL-to-GDSII design flow for gate-level M3D. Our tool flow is based on commercial tools built for 2D ICs and enhanced with our 3D specific methodologies. We use this flow along with a 28nm PDK to build layouts for the OpenSPARC T2 core. Our simulations show that at the same performance, gate-level M3D offers 16% total power reduction with 0% area overhead compared to commercial quality 2D IC designs.
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Cross Ref
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- S. Panth, K. Samadi, Y. Du, and S. K. Lim. High-Density Integration of Functional Modules Using Monolithic 3D-IC Technology. In Proc. Asia and South Pacific Design Automation Conf., 2013.Google ScholarCross Ref
Index Terms
- Design and CAD methodologies for low power gate-level monolithic 3D ICs
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